Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications

Abstract

In this study, a novel composite solder, Sn-3.5Ag-10.0Co, was tailored for transient liquid phase (TLP) bonding in electric vehicle power module integration. Employing a meticulous two-step joining process, the solder joint was transformed into a robust microstructure characterized by two high-melting point intermetallic compounds, Ni3Sn4 and (Co,Ni)Sn2. After 1 h of TLP bonding, the Sn-3.5Ag-10.0Co paste transformed into the IMCs, but voids persisted between them, particularly between (Co,Ni)Sn2 and Ni3Sn4. Voids significantly reduced after 2 h of bonding, with full coalescence of the joint microstructure observed. The joint continued to be densified after 3 h of TLP bonding, but voids tended to accumulate at the joint center. Failure analysis revealed crack propagation through Ni3Sn4/(Co,Ni)Sn2 interfaces and internal voids. The engineered Sn-Ag-Co TLP joint exhibited superior shear strength retention even at an elevated temperature of 200 °C, contrasting with the significant reduction observed in the Sn-3.5Ag control specimen due to remaining Sn.