Transient liquid phase sintering conductive adhesives as solder replacements

Gallagher, C.; Matijasevic, G.; Maguire, J.

doi:10.1109/ectc.1997.606223

Cited by 23 publications

(8 citation statements)

References 7 publications

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“…Consequently, it was confirmed by means of the cross-sectional observations that the fillers provide the ECA joint with metallurgical interconnections. In previous studies, conventional isotropic conductive adhesives, using both nonfusible and fusible fillers, 17,18 have been locally dispensed on metallized pads due to their isotropically conductive characteristics. Although the fusible conductive adhesive devel- oped in this study is an isotropic material, it also has anisotropically conductive characteristics, due to its coalescence and wetting characteristics.…”

Section: Resultsmentioning

confidence: 99%

Novel interconnection method using electrically conductive paste with fusible filler

Kim

Yasuda

Fujimoto

2005

Journal of Elec Materi

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A new class of electrically conductive adhesives (ECAs) was developed using fusible filler particles. Differential scanning calorimetry (DSC) was used to examine the curing behavior of the base resin material and the melting behavior of the filler particles. The formation of the interconnection before and after the curing process was observed by means of a microfocus x-ray system. The cross-sectional morphology of the electrical conduction path was investigated by optical microscopy. It is believed that the wetting and coalescence behavior of the molten filler particles are the main driving forces leading to the production of the interconnection between the electrodes. In addition, the metallurgical connections both between the particles and between the particles and the copper substrate were observed using scanning electron microscopy and electron probe microanalysis (EPMA).

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Section: Resultsmentioning

confidence: 99%

Novel interconnection method using electrically conductive paste with fusible filler

Kim

Yasuda

Fujimoto

2005

Journal of Elec Materi

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“…Here, the electrical connection is established through transient liquid phase sintering (TLPS) among metal and solder powder as well as to the conducting pads. Promising results have been reported with the SMT joints made from the TLPS conductive paste in terms of electrical conductivity, impact strength, and reliability, which are substantially better than those of the conventional conductive adhesives [19]. Another improvement has been reported with the high conductivity Pb-free conducting materials made of a conducting filler powder coated with a low melting point metal, a thermoplastic polymer, and other minor organic additives [20], [22].…”

Section: Conducting Adhesive Materialsmentioning

confidence: 92%

“…Upon reflow, an oxide-free, partially coalesced solder connection is obtained, which is polymer strengthened and reworkable at a low reflow temperature or in the presence of an organic solvent. A hybrid of solder and conductive adhesive joining technologies has been developed to exploit the advantages of both [12]. This new conductive adhesive is a mixture of a solder powder, a metal powder of high melting point such as copper, a fluxing agent, a polymer resin and other additives.…”

Section: Conducting Adhesive Materialsmentioning

confidence: 99%

“…A new class of conductive adhesive materials has been developed by replacing silver particles with other conducting particles, such as solder particles [18], a mixture of solder and copper [12], [19], tin-coated copper [15], [20], silver-coated copper [21], and others. A solder/polymer composite paste material has been developed by mixing solder powder particles, thermoplastic polymer resin in a volatile solvent, and a fluxing agent [18].…”

Section: Conducting Adhesive Materialsmentioning

confidence: 99%

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Development of conductive adhesive materials for via fill applications

Kang

Buchwalter

LaBianca

et al. 2001

IEEE Trans. Comp. Packag. Technol.

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As mobile computing and telecommunication electronics are spreading fast, a demand for microelectronics packaging schemes for high density, fine pitch, high performance and low cost becomes even more severe. Specifically, the conventional printed circuit board (PCB) with plated-through-hole (PTH) vias is difficult to justify its manufacturing cost as well as the packaging density requirement. To meet this challenge, several new manufacturing schemes of high density and high performance PCB have been recently introduced such as surface laminar circuit (SLC), any layer inner via hole (ALIVH) and others. This new PCB fabrication process is categorized as sequential build-up (SBU) or build-up multilayer (BUM) using laminate-based substrates, where via holes are filled with a conductive paste material to make reliable vertical or -interconnects. In this paper, a new electrically conducting paste material to be used for via filling is introduced. The new conducting material consists of a conducting filler powder coated with a low melting point metal or alloy, a mixture of several thermoset resins, and other minor organic additives. By varying the filler content and resin chemistry, several formulations have been produced to fill via holes with a high aspect ratio. Via fill experiments have been performed to demonstrate void-free microstructure with good electrical continuity. Various bulk properties such as thermal, electrical and mechanical have also been characterized to understand the material behavior during via filling as well as the field service.

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“…The sintered joint results in high adhesion strength (even at elevated operating temperatures), and retains its post-sintered shape during subsequent reflows and thermal excursions close to around 400 O C. The post-sintered microstructure of TLPS is shown in Fig, 5. Sintering conductive pastes are an alternative technology solution that enables high performance and reliability in various interconnection strategies (8), (9) . The comparison of conductive paths of post cured silver-epoxy and TLPS are shown in Fig.6.…”

Section: Tlps For Package Constructionmentioning

confidence: 99%

High reliability, improved performance and low cost “interconnect technology” for LED light engines

Ling¹,

Liu²,

Holcomb

et al. 2015

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

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The LED industry is extremely price sensitive to manufacturing cost. The challenge is to produce modules (or the light engines) without compromising reliability. The present approach is to work within the standard assembly flow structure and focus on improving the manufacturing yield through efficient process control. These yield enhancements are usually achieved in small increments. Therefore, it is necessary to revolutionize the packaging and interconnect technology and implement new assembly methodology concepts.This paper presents a novel packaging & interconnect technique that has been jointly developed with materials suppliers and an equipment manufacturer, while integrating a non-conventional assembly approach. The new LED component structure improves package thermal resistance without sacrificing electrical properties.It further introduces a new and efficient concept of on-line phosphor deposition on blue LED devices, thus drastically improving the manufacturing process flow. A pre-determined phosphor layer is deposited using an in-situ thickness monitoring system to ensure that the variation in chip-to-chip CIE values lie within a very narrow range ~ thus improving the component yield.In this paper the concept of this package and its design flexibility is presented. Reliability results of assembled components are shared. Limitations of current structure and the scope for future advancement are discussed.

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Transient liquid phase sintering conductive adhesives as solder replacements

Cited by 23 publications

References 7 publications

Novel interconnection method using electrically conductive paste with fusible filler

Novel interconnection method using electrically conductive paste with fusible filler

Development of conductive adhesive materials for via fill applications

High reliability, improved performance and low cost “interconnect technology” for LED light engines

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