Transient response of uniformly distributed RLC transmission lines

Cases, M.; Quinn, D.J.

doi:10.1109/tcs.1980.1084796

Cited by 50 publications

(8 citation statements)

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“…In this case, the expression for in (40) must be multiplied by 1. Noting this and simplifying (40), we can write the MTL stamp in terms of -parameters as (41) where (42) Matrix Exponential Stamp: An alternative form of the MTL stamp is also quite popular and it has the matrix exponential form [72], which is explained below. Equations (20) and (21) can be written in the hybrid form as (43) Using the terminal conditions, the solution of (43) can be written as (44) A relationship between the forms represented by (41) and (44) can be obtained as follows: Define as…”

Section: B Multiconductor Transmission Line Stampmentioning

confidence: 99%

Simulation of high-speed interconnects

2001

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With the rapid developments in very large-scale integration (VLSI) technology, design and computer-aided design (CAD) techniques, at both the chip and package level, the operating frequencies are fast reaching the vicinity of gigahertz and switching times are getting to the subnanosecond levels. The ever increasing quest for high-speed applications is placing higher demands on interconnect performance and highlighted the previously negligible effects of interconnects, such as ringing, signal delay, distortion, reflections, and crosstalk. In this review paper, various high-speed interconnect effects are briefly discussed. In addition, recent advances in transmission line macromodeling techniques are presented. Also, simulation of high-speed interconnects using model-reduction-based algorithms is discussed in detail.

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Section: B Multiconductor Transmission Line Stampmentioning

confidence: 99%

Simulation of high-speed interconnects

2001

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“…Similarly, another useful representation of the MTL stamp is in terms of ABCD parameters, which can be written as (40) In the next section, we will review a generic formulation of distributed interconnect circuit equations, suitable for general purpose circuit simulators.…”

Section: Matrix Exponential Stampmentioning

confidence: 99%

Recent Advances in Modeling and Simulation of High-Speed Interconnects

Nakhla

Achar

2005

Computational Methods in Large Scale Simulation

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The rapid increase in operating speeds, density and complexity of modern integrated circuits has made interconnect analysis a requirement for all state-of-the-art circuit simulators. Interconnect effects such as ringing, signal delay, distortion and crosstalk can severely degrade signal integrity. Interconnections can be from various levels of design hierarch. As the frequency of operations increases, the interconnect lengths become a significant fraction of the operating wavelength, and conventional lumped models become inadequate in describing the interconnect performance and transmission line models become necessary. This chapter describes some of the recent advances in transmission line simulation techniques. Application of mode-order-reduction algorithms to high-speed interconnect analysis is also presented.

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“…Then from (7), we have R The next step is to find A;'. Fortunately, A-' can be found explicitly by essentially using the known inverse of B , namely, [15] and With (14), (15), and (16), (10) yields (5) and (6).…”

Section: Proofmentioning

confidence: 99%