Transient simulation of electrochemical machining processes for manufacturing of surface structures in high‐strength materials

Abstract

Electrochemical machining (ECM) is a method for removing metal by anodic dissolution. At the interface between the workpiece surface and an electrically conductive fluid (electrolyte), the material is dissolved locally without direct physical contact to the cathodic tool. Due to the force‐free nature of the process, ECM is used for machining high‐strength or hard materials, such as titanium aluminides, Inconel, Waspaloy, and high nickel, cobalt, and rhenium alloys. However, determining suitable process parameters remains challenging due to their interacting effects on working distances during the machining process. Therefore a simulation‐based approach to process design substantially reduces resource and time investment to achieve the desired geometry of the finished part. This methodology requires data about the materials electrochemical properties, such as removal velocity and current efficiency, which have to be obtained experimentally. In this study, a methodology for acquiring and processing this data as well as the development of multiphysics simulation models is presented exemplarily for manufacturing a centrifugal impeller with a diameter of 14 mm consisting of the nickel alloy Inconel 713C for use in turbomachinery.

Study on the Effect of Magnetic Field on Temperature Domain During Electrolytic Processing

“…Therefore, in order to obtain the processing parameters that meet the requirements, a large number of process experiments are needed, which leads to the longer preparation period and higher cost of electrochemical processing, which is not easy to popularize the application of electrochemical processing [9][10][11]. In view of this problem, many scholars at home and abroad have carried out a lot of research on the simulation of electrochemical machining [12][13][14][15]. The simulation theory model has developed from the initial pure electric field simulation to the multi-field coupling simulation of the flow field and the temperature field [16][17][18][19][20][21][22][23][24][25][26][27].…”