Transient thermal analysis of fast switching devices by partially coupled FEM method

Transient Electrothermal Simulation of Power Semiconductor Devices

“…The detailed derivation of Fourier series solution can be found in [22]. The amplitude of each harmonic is obtained based on the solution of (11). After the inverse Fourier series transformation, the transient temperature distribution in the package is determined simultaneously.…”

“…The amplitude of each harmonics is defined by (14). Using the method in 1-D solutions, (12) can be transformed into a form similar to (11). Although the input matrix and transfer matrix will be much more complicated, the amplitudes of harmonics are solved based on (14).…”

“…This results in a decoupling of electrical and thermal behavior and limits the usefulness for selfconsistent physics-based circuit simulation models of power semiconductor devices and modules. Other drawbacks of 1-D equivalent RC thermal networks are the discrepancy in highfrequency or high-dissipation conditions [10], [11]. Extensive 2-D and 3-D ladders of RC cells can be used for thermal representation of power modules.…”

Dynamic electro-thermal modeling in Power Electronics Building Block (PEBB) applications

“…The curve is based on typical analysis of temperature evolution of the specific structure under a steady state, neglecting power dissipation during fast pulse width [6]. The finite element method (FEM) or finite difference method (FDM) are well known solutions for thermal modeling [7]- [9], which provides accurate solutions, however, the calculation speed is too slow, especially under the situation when there are numbers of switches coupled to each other. The most important issue is that both of these solutions cannot be directly integrated with electric circuit for transient simulations.…”

Fast 3D thermal simulation of power module packaging

“…Cauer networks are physical in nature and can model 3D heat diffusion; at their most detailed, they are effectively the same as finite difference. These R–C networks may also struggle to model coupling from multiple heat sources and may contain discrepancies in high frequency conditions . As stated, parameter extraction from detailed simulations is unattractive to a packaging designer because it is a manual time‐consuming process.…”