2002
DOI: 10.1021/cm020428s
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Transition from Amorphous Semiconductor to Amorphous Insulator in Hydrogenated Carbon−Germanium Films Investigated by Raman Spectroscopy

Abstract: Amorphous hydrogenated carbon-germanium films (a-Ge X C Y :H) were fabricated by plasma chemical vapor deposition in an audio frequency (af) three-electrode reactor using tetramethylgermane (TMGe) as a source compound. Two types of the material, namely semiconducting (a-S) and insulating (a-I) films characterized by quite different electronic properties, were produced. For example, electrical conductivity at room temperature, T room , amounts to approximately 10 -18 S/m (with activation energy E A ≈ 0.9 eV) an… Show more

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Cited by 47 publications
(39 citation statements)
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“…Most probably ion bombardment of depositing film, which is responsible for deposition of a-S material, promotes phase separation. As a result, the density of amorphous germanium clusters is sufficient to influence the material electronic structure [7]. This hypothesis has been strongly supported by impedance spectroscopy measurements carried out over a broad range of temperatures [3].…”
Section: Introductionmentioning
confidence: 76%
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“…Most probably ion bombardment of depositing film, which is responsible for deposition of a-S material, promotes phase separation. As a result, the density of amorphous germanium clusters is sufficient to influence the material electronic structure [7]. This hypothesis has been strongly supported by impedance spectroscopy measurements carried out over a broad range of temperatures [3].…”
Section: Introductionmentioning
confidence: 76%
“…An important insight has been provided by the results of Raman spectroscopy investigations [7]. It has been shown, against expectations, that carbon structures are not responsible for the observed change in electronic structure of the material, and the creation of sp 2 bonds cannot be correlated with the a-I/a-S transition.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, solubility of carbon in silicon is very low (10 17 cm À3 at the melting point) and in germanium extremely low (10 8 cm À3 ). For example, Vilcarromero et al [23] found that during rf-co-evaporation of Ge and C targets for production of Ge 1Àx C x films germanium atoms were dispersed in sp 3 hybridized carbon and over x > 0.2 sp 2 carbon domains were formed; López et al [24] observed in thin SiGeC films produced by ArF laser CVD of disilane, germane and ethene an independent incorporation of Ge and C atoms; Hu et al [22] produced Ge 1Àx C x films by rf sputtering in which germanium and carbon clusters were built in a composite amorphous material; Kazimierski et al [25] fabricated by plasma CVD in an audio frequency three electrode reactor insulating and semiconducting a-Ge x C y :H thin films using (CH 3 ) 4 Ge. The films possessed a composite structure of germanium cluster, chains and nanocrystals embedded in sp 3 /sp 2 carbon surroundings.…”
Section: Resultsmentioning
confidence: 99%
“…Also note that this line has an asymmetric contour and its half-width increases to 14 cm -1 which could be caused by partial disorder in the subsurface layer as well as by an internal stress. [49] [54] were found. It is also important that no…”
Section: Scanning Auger Microscopy (Sam)mentioning
confidence: 97%