Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications

Liu, Yu-Chen; Lwo, Ben-Je; Chung, Tai-Chiang

doi:10.1109/dtip62575.2024.10613075

2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2024

DOI: 10.1109/dtip62575.2024.10613075

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Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications

Yu-Chen Liu,

Ben-Je Lwo,

Tai-Chiang Chung

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Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications

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