The demand for polymer-based soft micro-electro-mechanical systems (MEMS) is
growing due to the substantial increase of flexible and wearable electronic
devices. In this context, electronically conducting polymers (ECPs) fulfil the
requirements for soft MEMS by offering the possibility of actuation and sensing,
however, their miniaturization, their integration attempts and their resulting
performances are still limiting their use in real applications. In this work,
elaboration, integration and operation of soft and efficient microtransducers
based on commercially available poly(3,4-ethyledioxythiophene):poly(styrene
sulfonate) conductive ink into flexible chips is demonstrated. This original
process overcomes existing hurdles to the fabrication of fully integrated
ECP-based devices with gold remote contacts directly in contact with ECPs and
further embedding in flexible support. These batch-fabricated chips are actuated
at low voltage (±3.0 V) in open-air with individual accessible electrical
connections. More importantly, the mechanical strain sensing is evidenced for
the first time on such small ECP-based devices after full integration and
demonstrating low impact of the microfabrication process. This work opens the
way for further development of soft ECP-MEMS and integration into more complex
systems with possible applications in microrobotics, microfluidics,
optoelectronics, biology, medicine or space.