We have fabricated Schottky diodes on GaN epitaxial wafer by using Ir/Pt Schottky contacts. After oxidation, the measured leakage current was decreased from 116 nA to 17.8 pA. In other words, the leakage current after annealing in O 2 was shown to be about four orders of magnitude smaller than that before annealing. These improvements may be attributed to IrO x formation of the metal layer, improvement of interface between the Schottky contact and the GaN layer and curing of defects due to oxidation. We also found that the Schottky barrier height and thermal stability after annealing is better than without annealing. 1 Introduction Recently, many people have paid much attention to nitride-based materials due to the wide direct bandgap, high saturation velocity, and high thermal conductivity. Because of the abovementioned properties, the nitride-based materials are promising for applications, not only in optoelectronic devices [1][2][3], but also electronic devices [4,5] such as metal-semiconductor field-effect transistors (MESFETs), and heterojunction field-effect transistors (HFETs). Most of these devices utilize Schottky contacts. However, a substantial leakage current through the Schottky contacts to III-V nitridebased semiconductors has resulted due to the high dislocation density on GaN epitaxial layers. Large leakage current adversely affects operation, power consumption, noise and reliability of the devices. Therefore, Schottky contacts to III-V nitride-based semiconductors with ultralow leakage current are one of the challenges to their use in optoelectronic and electronic devices. To reduce the leakage current and improve the breakdown voltage in Schottky barrier diodes, it is necessary to achieve a high Schottky barrier height at the metal/semiconductor interface. Employing a metal with high work function, such as Pt (5.65 eV) [6], Ni (5.15 eV) [7], or Pd (5.12 eV) [8] is a common method of maximizing the effective Schottky barrier height on GaN layers. However, the majority of these metal films are not stable under high temperature conditions due to inter-diffusion between the metal and the GaN [9]. Iridium (Ir, 5.46 eV) has been predicted to form thermally stable contacts on GaN. In the literature, Ir is often used as the thermally stable Schottky contact material on AlGaN/GaN heterostructure [10]. Although only few studies of oxidized Ir forming Schottky contacts on GaN MSM UV photodetectors have been reported [11], it has also been shown that Ir/Ni can form Schottky contacts on GaN Schottky UV photodiodes with low dark current [12]. Due its properties, Pt is the perfect material that provides a high degree of inertness. However, we know that the strength and durability can be improved by adding a small amount of Ir. Therefore, we used the multi-layer contact with high work function as our contact, including Ir and Pt in our study and compared the experimental results without and with annealing.