An ordinary amorphous silicon nitride-based p-i-n diode was electroformed under optimized process conditions, which led to its instant transformation to a semiconductor device with two-in-one properties: a bright visible light emitting diode and a resistive memory switching device; i.e. light emitting memory (LEM). In the present work, for a thorough understanding of the changes that occur during electroforming, SEM images and EDX analyses were performed on both top-view and cross-section of both as-deposited and electroformed diodes. It was seen from the top-view images that while the diode surface of the as-deposited diode had a smooth and homogeneous ITO top electrode, the electroformed diode exhibited a rough ITO surface. EDX analyses showed that ITO was completely removed from many point-like regions on the diode surface. Cross-sectional SEM images showed no clue of any material diffusion through the diode structure during electroforming, which was one of the suspected situations about our model. EDX results also showed no considerable increase of any of the ingredients of the ITO alloy (In, Sn or O) across the semiconductor (p-i-n) layers of the electroformed diode. In contrast to the roughened surface of the electroformed diode, the silicon-based layers of the diode below the ITO electrode seemed to be well-preserved. Real-time optical microscopy showed that the light is emitted through the regions of the diode surface where the residual ITO top electrode is present.