Trends of power semiconductor wafer level packaging

Liu, Yong

doi:10.1016/j.microrel.2009.09.002

Cited by 24 publications

(5 citation statements)

References 21 publications

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“…They were discovered in 1939 by Prileschajew . Thanks to their excellent thermal and mechanical properties, epoxy resins have been widely applied in a range of fields. − The global market for epoxy resins is driven by the increasing demand in the fields of chemistry, automotive, aerospace, civil engineering, leisure, electrical, marine, and many others…”

Section: Introductionmentioning

confidence: 99%

Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications

Shundo

Yamamoto

Tanaka

2022

JACS Au

134

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Epoxy resins are used in various fields in a wide range of applications such as coatings, adhesives, modeling compounds, impregnation materials, high-performance composites, insulating materials, and encapsulating and packaging materials for electronic devices. To achieve the desired properties, it is necessary to obtain a better understanding of how the network formation and physical state change involved in the curing reaction affect the resultant network architecture and physical properties. However, this is not necessarily easy because of their infusibility at higher temperatures and insolubility in organic solvents. In this paper, we summarize the knowledge related to these issues which has been gathered using various experimental techniques in conjunction with molecular dynamics simulations. This should provide useful ideas for researchers who aim to design and construct various thermosetting polymer systems including currently popular materials such as vitrimers over epoxy resins.

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Section: Introductionmentioning

confidence: 99%

Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications

Shundo

Yamamoto

Tanaka

2022

JACS Au

134

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show abstract

“…Epoxy resins, a class of thermosetting resins, have found use in a wide range of applications such as coating agents, adhesives, encapsulants, composites, , and so forth − thanks to their favorable mechanical properties, thermal properties, and solvent stability. Epoxy resins are based on a three-dimensional network formed via the curing reaction of epoxy and amino compounds.…”

Section: Introductionmentioning

confidence: 99%

Mesoscopic Heterogeneity in the Curing Process of an Epoxy–Amine System

et al. 2019

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Epoxy resins are composed of a three-dimensional network formed by chemical reactions between epoxy and amino compounds, which plays an important role in the mechanical properties. Thus, to use epoxy resins in various applications, it is necessary to gain a better understanding of their network structure. Here, we study the structural heterogeneity evolved in an epoxy−amine mixture during the curing process on the basis of a particle tracking technique, in which the thermal motion of probe particles in the mixture was tracked, small-angle X-ray scattering measurements in conjunction with coarse-grained molecular dynamics simulation. The heterogeneous environment was generated even at the initial stage of the curing process. Notably, the characteristic length scale was on the order of several hundreds of nanometers down to several tens of nanometers, depending on the extent of curing. Once a reaction occurs between a pair of epoxy and amino groups, the temperature at the site is locally elevated due to the heat of formation, accelerating a subsequent reaction nearby. Repeating such a situation, actively and scarcely reacted domains are formed. This is the main origin of the structural heterogeneity in epoxy resins.

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“…Wafer level packaging (WLP) has been one of the fastest growing technologies in semiconductor packaging industry due to high demands, reduced fabrication cost and enhanced performance [1] [2]. In a WLP, the redistribution layer (RDL) is used to re-route the I/O signal to the solder bumps.…”

Section: Introductionmentioning

confidence: 99%

Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging

Singh,

Rohlfs,

Sandmann

et al. 2024

IMAPSource Proceedings

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In wafer level packaging, polyimide and electroplated copper are dielectric and conducting materials respectively in the so-called redistribution layers. During the wafer fabrication process large amount of stress is generated in those layers due to curing shrinkage of the polyimide and the coefficient of thermal expansion mismatch of both materials to silicon which can lead to severe wafer bow after a high temperature curing. In different applications polyimide can be used either only as passivation layer over electroplated copper, or polyimide is applied before the redistribution layer and then a second polyimide layer is applied as passivation. In the current study the effect of different polyimide integrations is investigated. In-situ wafer bow measurements and finite element method studies were conducted with samples, with and without polyimide below redistribution layer, exposed to different curing temperatures to understand the change in wafer bow and copper residual stress. It is observed that wafers with polyimide before redistribution layer show higher stress relaxation in copper with decreasing curing temperature, resulting therefore in a lower wafer bow. A good agreement is achieved between the experimentally measured and the simulated wafer bow.

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Trends of power semiconductor wafer level packaging

Cited by 24 publications

References 21 publications

Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications

Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications

Mesoscopic Heterogeneity in the Curing Process of an Epoxy–Amine System

Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging

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