Triboelectric nanogenerator-based anodic bonding of silicon to glass with an intermediate aluminum layer

Lin, Yuxing; Shen, Honglie; Chen, Xiangyu; Li, Yufang; Xu, Yajun; Xu, Binbin

doi:10.1016/j.sna.2021.112950

Cited by 5 publications

(3 citation statements)

References 36 publications

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“…This is because at room temperature, the transportable ions in the solid polymer electrolyte are constrained by the Coulomb force and the surrounding intermolecular force, and it is difficult to move freely. This not only affects the bulk resistance of the material, but also limits the number of effective carrier migrations during the bonding process, which then affects the current change during the bonding process [ 17 , 18 , 19 ]. When the bonding temperature is increased, the internal structure of the solid polymer electrolyte is activated, thus generating higher molecular thermal motion energy and realizing the free movement of ions [ 36 , 37 , 38 ].…”

Section: Resultsmentioning

confidence: 99%

“…Under different bonding conditions (i.e., materials and process parameters), the current variation characteristics during anodic bonding differ. Previous research on anodic bonding has usually focused on the influence of bonding material properties, surface treatment, and bonding parameters on the bonding process, and rarely on the effect of current characteristics on the microscopic changes in bonding materials and the effects of the bonding process [ 15 , 16 , 17 , 18 , 19 , 20 , 21 ]. Consequently, the microscopic control and analysis of the entire bonding process are inadequate [ 22 , 23 , 24 , 25 ].…”

Section: Introductionmentioning

confidence: 99%

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Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface during Anodic Bonding of PEG-Based Encapsulation Materials and Aluminum

Zhao

2023

Polymers

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This study analyzed the mechanism underlying the effect of the bonding current on the bonding interface during anodic bonding on the basis of the anodic bonding of PEG (polyethylene glycol)-based encapsulation materials and Al. By establishing an equivalent electrical model, the effects of various electrical parameters on the dynamic performance of the bonding current were evaluated, and the change law of the bonding current transfer function was analyzed. By examining the gap deformation model, the conditions for contact between the interface gaps and the bonding current pair were determined, and the influence law of the gap deformation of the bonding interface was derived. By assessing the effect of the bonding current on the ionic behavior, we found that the larger the bonding current, the greater the number of activated mobile ions in the bonding material and the higher the field strength in the cation depletion area. From the anodic bonding experiments, it was found that increasing the bonding voltage can increase the peak current and improve the bonding efficiency. The SEM image after bonding shows that the bonding interface had no obvious defects; the higher bonding voltage can result in a thicker bonding layer.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface during Anodic Bonding of PEG-Based Encapsulation Materials and Aluminum

Zhao

2023

Polymers

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“…Anodic bonding [1][2][3] is an important technology in bonding two basic materials without an intermediate layer, and widely used for the bonding of glass to semiconductors, metals or other materials [4][5][6]. The technology was put forward firstly by Wallis and Pomerantz in 1969 [7] and was widely used in the fabrication of micro electromechanical system (MEMS) [8,9] due to its high quality [10], simple operation and low bonding temperature [11].…”

Section: Introductionmentioning

confidence: 99%

Study on the mechanism of glass-SiC-glass anodic bonding process

Cheng,

Hu,

Liu

et al. 2024

J. Micromech. Microeng.

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The connection of SiC to glass is important for the development of microelectromechanical systems. In the study, glass-SiC-glass with SiC as common anode was effectively bonded by using anodic bonding technology in atmosphere. The interfacial microstructure of bonded joints was analyzed by using SEM, EDS and TEM. The effect of the bonding voltage and bonding temperatures on the interfacial microstructure and mechanical property of glass/SiC/glass was investigated. The results indicated that a Na+ depletion layer formed in the glass adjacent to the SiC/glass interface due to the decomposition of Na2O compound in the glass and the migration of Na+ towards the upper surface of glass during anodic bonding. With elevating bonding temperatures or bonding voltages, the thickness of Na+ depletion layer was gradually increased and more O2- accumulated at the SiC/depletion layer interface, which was beneficial for the tensile strength of joints. But owing to the increased residual thermal stress, the tensile strength of the joints dropped with enhanced bonding temperature. The maximum tensile strength of the joint was about ~ 12.8 MPa when bonding at 450 ºС/1000 V/1 min. The joint mainly ruptured in the glass with a brittle fracture mode.

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Flexible anodic bonding for the bonding between elastomer and metal

Zhao¹,

Liu

et al. 2022

J of Applied Polymer Sci

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Considering the inadaptability of traditional anodic bonding to polymer materials, the flexible anodic bonding process is developed. The bonding characteristics of the dynamic intelligent electric fields with the low-temperature plasma surface treatment to polymer and ultrasonic-assisted preconnection before bonding are very suitable for the anodic bonding of polymer elastomer to aluminum (Al) sheet. A series of composite polyurethane elastomer cathode materials (CPECs) with good bonding properties are prepared and characterized. The highest ionic conductivity of CPECs can reach to 2.7 Â 10 À3 S/cm (CPEC2) at 75 C. After bonded, it is determined that a uniform and dense intermediate bonding layer showed by SEM is formed between CPECs and Al. In addition, different elements including C, O, F, S, and Al are clearly iden-

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Triboelectric nanogenerator-based anodic bonding of silicon to glass with an intermediate aluminum layer

Cited by 5 publications

References 36 publications

Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface during Anodic Bonding of PEG-Based Encapsulation Materials and Aluminum

Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface during Anodic Bonding of PEG-Based Encapsulation Materials and Aluminum

Study on the mechanism of glass-SiC-glass anodic bonding process

Flexible anodic bonding for the bonding between elastomer and metal

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