Tribological Characterization of Anionic Supramolecular Assemblies in Post-STI-CMP Cleaning Solution Using a Novel Post-CMP PVA Brush Scrubber

Abstract

We have shown how different micellar (SDBS) vs. polyelectrolytic (PSSA) supramolecular assemblies in post-CMP cleaning solutions differ in their tribological performance when used in a novel PVA scrubber for 300-mm silicon dioxide wafer cleaning. Significant differences in real-time shear force and coefficient of friction data from the wafer-solution-brush interface (both in time domain as well as frequency domain) have been attributed to differences in each supramolecule’s chemical functionality and structure, which in turn, have been correlated to wafer-level defects. The work has underscored the importance of measuring the tribological attributes of post-CMP cleaning processes in an effort to improve cleaning performance.

Utilizing an α,β-Unsaturated Dicarboxylic Acid for a Defect Initiated Residue Removal During Cu post-Chemical Mechanical Planarization Cleaning

“….-The single-sided PVA brush scrubber (PCC-300, Araca Inc.) 29,30 was utilized to simulate the generation of shear force during a p-CMP cleaning session with the aforementioned cleaning chemistries. 30 s scrubbing experiments obtaining 30,000 shear force data were averaged to calculate the mean shear force during the process.…”