Triode magnetron sputtering TiN film deposition

Fontana, L.C.; Muzart, J.L.R.

doi:10.1016/s0257-8972(99)00032-8

Cited by 39 publications

(17 citation statements)

References 14 publications

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“…Glow discharge processes, as plasma assisted chemical vapor deposition (PACVD), plasma assisted physical vapor deposition (PAPVD), etching, nitriding or nitrocarburizing and surface cleaning are exhaustively used in industry [1][2][3][4][5][6][7][8][9][10][11][12] . In these techniques, the reactive species generated in the plasma produce an activated processing and the ion bombardment of the parts or the target is used for heating or sputtering respectively.…”

Section: Introductionmentioning

confidence: 99%

Plasma sintering of unalloyed iron: a study of surface porosity

et al. 2004

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Samples of unalloyed iron powder were compacted and sintered in an abnormal glow discharge, generated in a gas mixture of 80% Ar + 20% H 2 by using a pulsed power source. The samples were placed on a holder, acting as the discharge cathode, and were heated by the bombardment of ions, strongly accelerated in the cathode sheath. Sintering was performed at temperatures of 1173, 1273 and 1373 K for 30 min, varying the voltage applied to the cathode from 400 to 700 V and pressure ranging from 470 to 2650 Pa. It is shown that the kinetic energy of ions striking the sample surface increased approximately three times, when the voltage changed from 400 to 700 V, with a corresponding reduction of surface porosity. The surface sealing is related to the ion bombardment, which produced a high mobility of surface atoms and consequent enhanced diffusion as well as sputtering and condensation on the concave surface, resulting in an activation of surface sintering.

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Section: Introductionmentioning

confidence: 99%

Plasma sintering of unalloyed iron: a study of surface porosity

et al. 2004

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“…O Triodo Magnetron Sputtering surgiu no final da década de 1990 [24]. A principal diferença entre este processo e o magnetron sputtering convencional é a presença de uma tela, situada em frente ao alvo e posicionada na borda da região luminescente do plasma.…”

Section: Sputteringunclassified

“…Com isso, os átomos atingem o substrato com maior energia. O processo de triodo magnetron sputtering reduz drasticamente [24] o ciclo de histerese, mantendo a taxa de deposição praticamente inalterada. Para processos contendo somente Nitrogênio e Titâ-nio, essa histerese pode ser completamente eliminada.…”

Section: Sputteringunclassified

“…Para processos contendo somente Nitrogênio e Titâ-nio, essa histerese pode ser completamente eliminada. A descarga é mais estável, não ocorrendo os indesejáveis arcos presentes no magnetron sputtering convencional [24].…”

Section: Sputteringunclassified

“…O equipamento foi costruído no próprio departamento [23] e é capaz de realizar tratamentos de nitretação bem como deposição de filmes pelo processo de Triodo Magnetron Sputtering [24].…”

Section: Equipamentounclassified

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