TSV Antennas for Multi-Band Wireless Communication

Pano, Vasil; Tekin, İbrahim; Yilmaz, Isikcan; Liu, Yuqiao; Dandekar, Kapil R.; Taşkın, Barış

doi:10.1109/jetcas.2020.2974236

Cited by 20 publications

(10 citation statements)

References 40 publications

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“…A multi-chip architecture enhanced with wireless interconnects is proposed in [4], but a single short-range TRX is taken as a baseline and only a single fixed dataflow is analyzed. WIENNA is the first scaleout-friendly architecture that leverages a wireless NiP, using concepts such as TSV antennas [19], asymmetric wireless multi-chip design [3] and reconfigurable dataflows.…”

Section: Resultsmentioning

confidence: 99%

Dataflow-Architecture Co-Design for 2.5D DNN Accelerators using Wireless Network-on-Package

Guirado

Kwon

Abadal

et al. 2021

Proceedings of the 26th Asia and South Pacific Design Automation Conference

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Deep neural network (DNN) models continue to grow in size and complexity, demanding higher computational power to enable real-time inference. To efficiently deliver such computational demands, hardware accelerators are being developed and deployed across scales. This naturally requires an efficient scale-out mechanism for increasing compute density as required by the application. 2.5D integration over interposer has emerged as a promising solution, but as we show in this work, the limited interposer bandwidth and multiple hops in the Network-on-Package (NoP) can diminish the benefits of the approach. To cope with this challenge, we propose WIENNA, a wireless NoP-based 2.5D DNN accelerator. In WIENNA, the wireless NoP connects an array of DNN accelerator chiplets to the global buffer chiplet, providing highbandwidth multicasting capabilities. Here, we also identify the dataflow style that most efficienty exploits the wireless NoP's high-bandwidth multicasting capability on each layer. With modest area and power overheads, WIENNA achieves 2.2X-5.1X higher throughput and 38.2% lower energy than an interposer-based NoP design.

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Section: Resultsmentioning

confidence: 99%

Dataflow-Architecture Co-Design for 2.5D DNN Accelerators using Wireless Network-on-Package

Guirado

Kwon

Abadal

et al. 2021

Proceedings of the 26th Asia and South Pacific Design Automation Conference

View full text Add to dashboard Cite

show abstract

“…Wireless interconnects: A new window of opportunity for wireless interconnects has emerged by bridging the horizontal and vertical axes. The vertical through-silicon-via (TSV)based antennas (TSV-As) can pierce through the interposer within the 2.5D/3D multi-die packages and radiate laterally, with the interposer acting as a waveguide with only a 3 dB loss over 10 mm of distance [13]. However, the wireless interface ing the processing in the analog domain (e.g., inmemory, optical, and DNA computing).…”

Section: Interconnect Architectures and Topologies For Interposer-int...mentioning

confidence: 99%

“…Due to this limitation, it becomes challenging to adopt wireless interconnects to achieve the target performance needs of quantum computing, optical computing, and in-memory computing paradigms (Table 1). Nevertheless, wireless interconnects which do not have physical layouts, are perfectly suitable for supporting massive broadcast or establish fast links between distant chips [13]. Due to this capability, wireless interconnects can interface with a massively parallelized DNA memory, to realize the full potential of the DNA storage technology, or to implement an ultra-fast control channel across the entire heterogeneous system which can result in completely novel memory coherency and other control protocols.…”

Section: Interconnect Architectures and Topologies For Interposer-int...mentioning

confidence: 99%

Interconnects for DNA, Quantum, In-Memory, and Optical Computing: Insights From a Panel Discussion

et al. 2022

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“…Small antennas in the mmWave bands and beyond [23]- [26] can be feasibly integrated, and broadcast messages [18], [20], [27]. Figure 1 shows vertical monopole antennas based on Through-Silicon Vias (TSVs), which perforate the bulk silicon [26]. Information coming from a core is modulated by the transceiver and sent by the antenna.…”

Section: A Motivation For Wireless Network On Chipmentioning

confidence: 99%