TSV Based Orthogonal Coils With High Misalignment Tolerance for Inductive Power Transfer in Biomedical Implants

Qian, Libo; Qian, Kefang; Shi, Yong; Xia, Huakang; Jian, Wang; Xia, Yinshui

doi:10.1109/tcsii.2020.3048040

Cited by 14 publications

(3 citation statements)

References 27 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…There are various equivalent circuit models for on-chip spiral inductor, which can hardly be directly applied to the magnetic core TSV-inductor [48][49][50]: (1) TSV, RDL, and magnetic core have different skin and parasitics effects from the planar inductor; (2) Unlike the planar structure that couples to the adjacent wires within the same layer, TSV-inductor may have couplings to the substrate and adjacent layers [48][49][50]. On the other hand, the conventional full-wave EM simulation is usually time-consuming to characterize the magnetic core TSV-inductor, and almost inapplicable to SPICE level circuit simulation when designing the DC-DC converter.…”

Section: Equivalent Circuit For Magnetic Core Tsv-inductormentioning

confidence: 99%

Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter

Wen

Xiao

Chen

et al. 2022

ACM Trans. Des. Autom. Electron. Syst.

View full text Add to dashboard Cite

The conventional on-chip spiral inductor consumes a significant top-metal routing area, thereby preventing its popularity in many on-chip applications. Recently through-silicon-via (TSV) based inductor (also known as TSV-inductor) with a magnetic core has been proved to be a viable option for the on-chip DC-DC converter. The operating conditions of these inductors play a major role in maximizing the performance and efficiency of the DC-DC converter. However, there is a critical need to study the design and optimization details of magnetic core TSV-inductors with the unique 3D structure embedding magnetic core. This paper aims to provide a clear understanding of the modeling details of a magnetic core TSV-inductor and a design and optimization methodology to assist efficient inductor design. Moreover, a machine learning assisted model combining physical details and artificial neural network (ANN) is also proposed to extract the equivalent circuit to further facilitate DC-DC converter design. Experimental results show that the optimized TSV-inductor with the magnetic core and air-gap can achieve inductance density improvement of up to 7.7 × and quality factor improvements of up to 1.6 × for the same footprint compared with the TSV-inductor without a magnetic core. For on-chip DC-DC converter applications, the converter efficiency can be improved by up to 15.9% and 6.8% compared with the conventional spiral and TSV-inductor without magnetic core, respectively.

show abstract

Section: Equivalent Circuit For Magnetic Core Tsv-inductormentioning

confidence: 99%

Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter

Wen

Xiao

Chen

et al. 2022

ACM Trans. Des. Autom. Electron. Syst.

View full text Add to dashboard Cite

show abstract

“…However, the coupling level varies between different positioned transmitter and receiver coils, and activating all coils simultaneously can lead to unnecessary energy losses and the issue of cross-coupling among multiple coils should not be overlooked [11][12][13]. Additionally, by altering the shape and structure of the coils, such as using DD-type coils, DDQ-type coils, multi-layer stacked coils, and 3D orthogonal coils, a uniform and symmetric magnetic field is formed, reducing the system's sensitivity to coil misalignment [14][15][16]. Considering the materials for coils, some scholars have suggested using superconducting materials due to their low-loss characteristics, which can reduce ohmic losses in energy transmission and improve the quality factor of the resonant coils, thereby enhancing the system's transmission efficiency.…”

Section: Introductionmentioning

confidence: 99%

Design and Optimization of Coil for Transcutaneous Energy Transmission System

Wu,

Li,

Chen

et al. 2024

Electronics

View full text Add to dashboard Cite

This article presents a coil couple-based transcutaneous energy transmission system (TETS) for wirelessly powering implanted artificial hearts. In the TETS, the performance of the system is commonly affected by the change in the position of the coupling coils, which are placed inside and outside the skin. However, to some extent, the influence of coupling efficiency caused by misalignment can be reduced by optimizing the coil. Thus, different types of coils are designed in this paper for comparison. It has been found that the curved coil better fits the surface of the skin and provides better performance for the TETS. Various types of curved coils have been designed in response to observed bending deformations, dislocations, and other coupling variations in the curved coil couple. The numerical model of the TETS is established to analyze the effects of the different types of coils. Subsequently, a series of experiments are designed to evaluate the resilience to misalignment and to verify the heating of the coil under conditions of severe coupling misalignment. The results indicated that, in the case of misalignment of the coils used in artificial hearts, the curved transmission coil demonstrated superior efficiency and lower temperature rise compared to the planar coil.

show abstract

“…Therefore, the different WPT techniques have already been applied for wireless powering bioelectronic implants. For instance, near-field WPT is employed for subcutaneous pacemakers [11], [12], neural and spinal cord stimulators [13], cochlear [14], and ocular implants [15], among other. All these applications share the same characteristic of having a small implantation depth.…”

Section: Introductionmentioning

confidence: 99%