Electrical Design of Through Silicon Via 2014
DOI: 10.1007/978-94-017-9038-3_7
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TSV Decoupling Schemes

Abstract: Three-dimensional (3D) through silicon via (TSV) technologies promise increased system integration at lower cost and reduced footprint, as well as increased system bandwidth. Three-dimensional TSV may be implemented by simply adapting current silicon fabrication and package technologies. There is a strong demand for 3D, high-density and the heterogeneous integration of silicon and passive components because 3D integrated circuit (3D ICs) increase layout complexity due to the needs for additional solution space… Show more

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