TSV fault contactless testing method based on group delay

Shang, Yongfeng; Zhao, Yamin; Li, Chunquan; Tan, Min; Zeng, Lang

doi:10.1080/00207217.2020.1870735

Cited by 2 publications

(1 citation statement)

References 29 publications

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“…11 The contactless electrical test method is mainly used to obtain the electrical signal of the defective TSV output by applying the corresponding excitation, and compares it with the intact TSV output and the difference is amplified, thus defect detection can be realized. 12 For further mastery the effects of short and open defects on the electrical of TSV channel, a noninvasive method of defects analysis on high-speed TSV channel is proposed. The method is demonstrated with S-parameter and time-domain reflectometry measurement results.…”

Section: Introductionmentioning

confidence: 99%

Internal defect identification method of TSV 3D packaging based on built-in integrated sensor

Huang

Yin

Liu

et al. 2022

Advances in Mechanical Engineering

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TSV (Through Silicon Via) is a key technology for three-dimensional (3D) packaging due to its unique vertical interconnection method. However, its particular manufacturing process of-ten leads to internal defects, such as gaps, bottom voids, filling missing, which are usually difficult to be detected by common means. In order to discover the internal defect of TSV packaging effectively, a novel non-destructive inspection method based on built-in integrated temperature sensor array is proposed. The relationship between temperature distribution and internal defect is dis-covered and then corresponding sensor array layout is designed. The simulation analysis shows that this kind of sensor array can recognize the internal TSV defect. And supervised machine learning is used to construct the classification model by which different defects can be found and classified with relatively high accuracy, and the classification accuracy rate can reach 95.625%. Experiments were conducted and the rationality of this built-in sensing array was verified. The research provides a non-destructive testing method for TSV internal defects based on bulit-in-integrated sensors, and verifies the feasibility of sensor arrangement through simulation, laying a foundation for the realization of later TSV design optimization.

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Section: Introductionmentioning

confidence: 99%