TSV reliability model under various stress tests

Abstract

Through Silicon Via (TSV) is the key technology for the 2.5D and 3D packaging, but reliability evaluations on the new technology products are limited because of the complexity of the environmental issues. To this end, reliability experiments on self-design TSV samples under combinations of several different environmental variables were proposed and performed in this study. The Weibull distribution model was next employed for reliability analyses and the parameters for each of the experimental results were extracted. After analyzing the Weibull parameters, factors that accelerate TSV unreliability are compared with discussions. This paper finally presents failure analyses through OM/SEM observations IntroductionDue to the advantages such as higher density, faster signal transmission, lower power consumption, broader functionality, and the abilities on heterogeneous connections, 2.5D and 3D packaging integration with TSV (Through Silicon Via) technology have drawn the attention of the packaging industry in the past decade, and the TSV applications were fast expanding at the same time. As the maturity of the TSV manufacturing process and the diverseness of possible TSV application, reliability evaluations on the newly developed technology products were rapidly introduced in the literature in recent years [1-3]. However, because of the complexity from many different environmental effects, the published TSV reliability data are still limited so that further related studies are needed.Based on our earlier works on TSV property analyses [4][5] and the first reliability study on a TSV structure [6], an advanced study on TSV reliability under several different environmental variables was proposed and performed in this paper. To this end, a typical TSV structure for CIS (CMOS Imaging Sensor) applications was first designed and made. To eliminate the parasitic resistance from the interconnecting wires and the contact resistance from the probing, four-point probe (4PP) measurements were employed for more accurate resistance measurements.After sample preparations, stress tests with different variables were performed. That is, the TSV samples were tested under several different environmental test conditions which were combinations of current bias, thermal aging, temperature cycling, and thermal-humidity cycling according to the JEDEC/JEP standards, and the failure criterion is set as

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

“…The electrical conductivity (≈ 2.5 × 10 5 S/cm) and the CTE (≈ 7 × 10 −6 / • C) values of the Cu-CNT filled TSVs were comparable to those of pure Cu and Si-wafers, respectively. Lwo et al performed a Weibull analysis to analyze the performance of TSVs in harsh conditions [160]. They discovered that the durability of TSV was significantly impacted by thermal cycling and bias current.…”

“…Dielectric bonding techniques, such as polymer adhesive and SiO 2 fusion bonding, are widely utilized to connect sections of chips. An interlayer of polymer serves as a bonding glue in adhesive bonding, which joins the chips together [160]. Epoxy [187][188][189], BCB (benzocyclobutene) [190][191][192], polyimide [193,194], and impression resist [195,196] are examples of thermosetting polymers that are often used as adhesives.…”

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

“…where α Cu and α CNT are the CTE of Cu and CNT, respectively, K Cu and K CNT are the bulk moduli of Cu and CNT, respectively, and ϕ Cu and ϕ CNT are the volumetric fraction of Cu and CNT, respectively. Lwo et al [73] studied the reliability of TSV under various environmental conditions and analyzed using Weibull analysis. Bias current and thermal cycling were found to be decisive factors affecting the reliability of TSV.…”

2k Factorial Experiments in Reliability Analysis for Weibull and log-normal Distributions

“…Therefore, the cost of unreliability can damage a company's image. Many manufactures have adopted reliability testing to meet and exceed the demands of customers [9]. Considering the reliability definition by Crowder, 2002 [10] as "probability of performing without failure a specified function under given conditions for a specified period of time."…”