2018 IEEE International Electron Devices Meeting (IEDM) 2018
DOI: 10.1109/iedm.2018.8614507
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Tunability of Parasitic Channel in Gate-All-Around Stacked Nanosheets

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Cited by 36 publications
(19 citation statements)
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“…1b). In order to enhance the device characteristics of advanced-node semiconductor devices (e.g., FinFETs [5] and stacked nanosheet devices [6], [7]), the exact geometry of epitaxially grown Si or SiGe is crucial.…”
Section: Introductionmentioning
confidence: 99%
“…1b). In order to enhance the device characteristics of advanced-node semiconductor devices (e.g., FinFETs [5] and stacked nanosheet devices [6], [7]), the exact geometry of epitaxially grown Si or SiGe is crucial.…”
Section: Introductionmentioning
confidence: 99%
“…They were manufactured by CEA-LETI, with both Si channels of 9nm thickness (HFIN). The gate stack is composed of a 2nm oxide (HfO2) and a TiN and Tungsten metal [5]. Fig.…”
Section: Characteristics Of the Measured Devicesmentioning
confidence: 99%
“…Fig. 1 presents a TEM view of 2 stacked nanowires with different fin width (WFIN) [5]. The total device channel width of stacked nanowire is a sum of widths from two levels of the device.…”
Section: Characteristics Of the Measured Devicesmentioning
confidence: 99%
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“…They were manufactured by CEALETI, with both Si channels of 9nm thickness (HFIN). The gate stack is composed of a 2nm oxide (HfO2) and a TiN and Tungsten metal [5].…”
Section: Characteristics Of the Measured Devicesmentioning
confidence: 99%