Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Abstract-Tungsten composite films of thickness as low as 19 nm have been deposited using a 30 keV Ga + focused-ion-beam with tungsten carboxyl (W(CO) 6 ) as the gas precursor. Films of thickness 25 nm or more are superconducting with a transition temperature exceeding 5 K. Films in the thickness range 25 nm to 50 nm show an increasing T c for a decreasing film thickness. This correlates well with the measured dependence of the normal state resistivity upon film thickness. We attribute this behavior to an increase in the BCS electron-phonon interaction potential resulting from a reduction in the electron mean-free-path as the film thickness is reduced. In the light of these data we discuss the applicability of FIB-deposited tungsten for devices requiring ultra-thin superconducting films, including photon detectors and phase-slip qubits.