Consistent with the SoP concept, AiP is an antenna that is realized on the package of the driving circuit [2]. There are many advantages of AiP that are beneficial for RF systems, the most prominent being the ability of realizing multilayer (vertically integrated) antennas that reduce the overall size of the system. Further, no separate printed circuit boards (PCB) for antenna realization or connections to an external antenna board are required, increasing compactness and cost savings. Finally, efficient antennas can be realized in low loss packaging technologies, particularly at mmWave bands. These aspects are discussed in detail in the coming sections. Low-temperature co-fired ceramic (LTCC) is one of the mainstream technologies for AiP designs. This chapter focuses on AiP designs in LTCC technology. Before moving on to details of AiP design, LTCC technology is introduced in the next section. Section II LTCC Technology LTCC is a multilayer ceramic tape system, which has recently gained popularity not only as a packaging technology but also as an efficient medium to realize passive components. In this section, we first briefly introduce the LTCC technology and then discuss the advantages and issues related to this technology. Later parts of the chapter focus on the LTCC process flow in detail. Finally, we list the major LTCC material suppliers and worldwide service foundries as a quick reference guide for readers.