Tunable oriented cellulose/BNNSs films designed for high-performance thermal management

Song, Na; Wang, Pei; Jin, Liyuan; Zhang, Feng; Wang, Zhifeng; Ding, Peng

doi:10.1016/j.cej.2022.135404

Cited by 47 publications

(21 citation statements)

References 66 publications

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“…Until now, few works has been done for thermal management of flexible/stretchable electronic devices due to the lack of deformation quantity of their samples, which may hinder the development of modern flexible/stretchable electronics. Here, previous results of polymer- or polymer-based electrically insulating materials with exceptional performance such as strain limit, in-plane thermal conductivity, and Young’s modulus, have been summarized for comparison, ,,− as shown in Figure . Although the sample in our work has an intermediate in-plane thermal conductivity, while the high stress limit and ultralow Young’s modulus endows it a super elasticity, which is of vital importance for thermal management of flexible/stretchable electronics.…”

Section: Resultsmentioning

confidence: 99%

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

Wang

Ding

et al. 2022

ACS Appl. Mater. Interfaces

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Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending–releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 ± 1 °C (10.5 °C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPU-BNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density.

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Section: Resultsmentioning

confidence: 99%

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

Wang

Ding

et al. 2022

ACS Appl. Mater. Interfaces

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“…The results are shown in Figure 4f and Table S3. Possibly due to the regular rigid rodlike molecular structure and the high crystallinity, 14,19,20,43 the in-plane TC (8.35 W m −1 K −1 ) of the PBONF film is already much higher than those of most polymers (generally lower than 1 W m −1 K −1 ). The introduction of FG further improves the in-plane TC of the composite films.…”

Section: Morphological and Structural Characterization Of Pbonfmentioning

confidence: 99%

Mechanically Robust Fluorinated Graphene/Poly(p-Phenylene Benzobisoxazole) Nanofiber Films with Low Dielectric Constant and Enhanced Thermal Conductivity: Implications for Thermal Management Applications

et al. 2022

ACS Appl. Nano Mater.

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Low-dielectric materials have found broad applications in microelectronics but are limited by poor mechanical properties and thermal conductivity. In this study, a class of nanocomposite films based on fluorinated graphene (FG) was developed by replacing the traditional polymer matrix with a 3D interconnected poly(p-phenylene benzobisoxazole) (PBO) nanofiber network. The FG nanosheets are uniformly distributed in the porous network of PBO nanofibers (PBONF) and stacked orderly to form a nacre-like layered structure while paving effective thermal conduction paths. Ultimately, the strong interfacial bonding and efficient synergy between FG and PBONF endow the composite films with unparalleled tensile properties (strength and modulus up to 295.4 MPa and 7.79 GPa, respectively) and folding endurance (no drop in tensile properties after 1000 folds), ultralow dielectric constant (as low as 1.71), and excellent thermal conductivity (12.13 W m–1 K–1). In addition, these FG/PBONF composite films also exhibit an ultrahigh thermal stability (5% weight loss temperature higher than 540 °C), which makes them promising for the heat dissipation of high-power electronic devices in extreme environments.

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“…Cellulose, originating from cotton, flax, ramie, and other green sources, is the most abundant natural polymer on Earth, and has been developed for electronic devices, [6][7][8] biomedicine, 9 and other applications. Moreover, cellulose films have been applied to synthetic packaging films due to its various satisfactory properties, including renewability, biodegradability, biocompatibility, and environmental friendliness.…”

Section: Introductionmentioning

confidence: 99%

A binder-free method to produce heat-sealable and transparent cellulose films driven by a confined green solvent

Huang

Chen

et al. 2023

Green Chem.

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Tunable oriented cellulose/BNNSs films designed for high-performance thermal management

Cited by 47 publications

References 66 publications

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

Mechanically Robust Fluorinated Graphene/Poly(p-Phenylene Benzobisoxazole) Nanofiber Films with Low Dielectric Constant and Enhanced Thermal Conductivity: Implications for Thermal Management Applications

A binder-free method to produce heat-sealable and transparent cellulose films driven by a confined green solvent

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