Handbook of Porous Silicon 2018
DOI: 10.1007/978-3-319-71381-6_19
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Tunable Properties of Porous Silicon

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Cited by 13 publications
(8 citation statements)
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“…The pSi layers had an average pore size of 13.6±4.1 nm and depth of 5.9±0.01 μm as determined by scanning electron microscopy (SEM) (Figure a and b). pSi layers were thermally oxidized in air at 600 °C for 1 h to improve their stability in aqueous solutions . Following this, plasma deposition was utilized to produce the polymeric capping films on the surface of the porous layer.…”
Section: Resultsmentioning
confidence: 99%
“…The pSi layers had an average pore size of 13.6±4.1 nm and depth of 5.9±0.01 μm as determined by scanning electron microscopy (SEM) (Figure a and b). pSi layers were thermally oxidized in air at 600 °C for 1 h to improve their stability in aqueous solutions . Following this, plasma deposition was utilized to produce the polymeric capping films on the surface of the porous layer.…”
Section: Resultsmentioning
confidence: 99%
“…PSi is commonly obtained via electrochemical etching, a fabrication strategy that does not require expensive equipment, and allows a good reproducibility of the fabricated PSi substrates. This technique enables a fine control on the pore size and on the optical response of the material [ 25 , 26 ]. This tuning is generally not easily achievable in other porous materials, such as porous alumina [ 27 , 28 ] or porous titania [ 29 , 30 ].…”
Section: Introductionmentioning
confidence: 99%
“…For some time, porous silicon (pSi) has attracted great attention in applications relevant to diagnosis and therapy, owing in part to its biocompatibility and biodegradability in aqueous physiologically-relevant environments [1,2,3,4]. Such a response in vitro/in vivo of pSi is sensitively dictated by porous morphology, associated Si domain dimension and surface chemistry [4,5]. While demonstrating utility in applications as diverse as bioimaging [6], drug delivery [7], and nucleotide sensing [8], pSi in a mesoporous form also exhibits some detrimental properties, namely intricate dendritric morphologies, and requires corrosive reagents in its preparation and expensive starting material (wafer grade Si).…”
Section: Introductionmentioning
confidence: 99%