“…The highly conductive Cu patterns have been printed on the flexible substrates, such as glass, − polyvinylidene fluoride, polyethersulphone (PES), polyimides, − polyethylene terephthalate (PET,) − and yttria-stabilized zirconia (YSZ) ceramics . This has led to several emerging electronics applications, involving radio frequency identification devices (RFID), − sensors, − antennas, − photovoltaic electrode contacts, − catalysts, − flexible and transparent electronics, − and thin film transistors. , We discuss the preparation of Cu ink materials and their printing deposition followed by an adequate thermal decomposition or sintering process to obtain flexible hybrid electronics. This review also describes how to keep the printed copper pattern from being oxidized and how to improve its electronic performance …”