“…Design, construction, and operation of the microfabricated electrode array devices has been described in detail previously. 19,20 Briey, silicon wafers (P(100), 500 mm thick, 15 cm diameter, 5000 Å oxide layer; University Wafer), were cleaned in a reactive ion etcher, spin coated with hexamethyldisilazane (J.T. Baker) followed by a positive photoresist (Shipley 1827; Rohm & Haas), patterned, and developed (MF-319 developer; Rohm & Haas).…”