Carbon nanotubes are extremely sensitive to the molecular species in the environment and hence require a proper passivation technique to isolate them against environmental variations for the realization of reliable nanoelectronic devices. In this paper, we demonstrate a parylene-C passivation approach for CNT thin film transistors fabricated on a flexible substrate. The CNT transistors are encapsulated with 1 and 3 m thick parylene-C coatings, and the transistor characteristics are investigated before and after passivation. Our findings indicate that thin parylene-C films can be utilized as passivation layers for CNT transistors and this versatile technique can be readily applied for the encapsulation of CNT devices such as field effect transistors, p-n diodes, and logic circuits fabricated on flexible substrates. © 2010 American Institute of Physics. ͓doi:10.1063/1.3499758͔Single-walled carbon nanotubes ͑SWNTs͒ with their unique physical, electrical, and mechanical properties are being considered as a potential replacement for existing semiconducting materials in flexible electronics. Their mobility can exceed 10 5 cm 2 / V s −1 , and they have large current carrying ͑10 9 A / cm 2 ͒ capability, higher ON/OFF ratios ͑Ͼ10 5 ͒ and extreme mechanical flexibility. 1 SWNT based field effect transistors ͑FETs͒ exhibit p-type behavior in the ambient environment, and they can be converted to n-type by doping e.g., polymer functionalization. 2 Carbon nanotube ͑CNT͒ flexible devices such as high frequency FETs, p-n diodes, and logic circuits have already been reported. 3 Their large surface area to volume ratios and extreme sensitivity to the molecular species in the environment ͑e.g., oxygen, moisture, etc.͒ can significantly affect the electrical properties of CNT transistors. [4][5][6] To isolate SWNT based flexible transistors from environmental factors, thin and flexible passivation layers need to be investigated prior to deployment of these devices in real world applications.Several groups have already explored passivation of CNT based devices with thin polymeric films yet had limited success. For example, Dai et al. 5 have reported a 1.7 m polymer ͓polymethyl-methacrylate ͑PMMA͔͒ coating for passivating CNT based transistors. When the PMMA encapsulated devices were exposed to a humid ambient, the electrical characteristics of the transistors changed due to permeation of water molecules through PMMA. Similarly, Zhang et al. 7 used SU-8/PMMA ͑2 m / 200 nm͒ to passivate their CNT FETs. After exposing their devices to an NO 2 environment for 1 h, they have noted that the gas molecules diffused through the SU-8/PMMA layer and caused variations in the transistor behavior. In addition to polymeric encapsulants, Kaminishi et al. and Kim et al. 8 ͑15 nm deposited using atomic layer deposition ͑ALD͒ at 300°C͒ layers as passivation layers for CNT FETs. The drawback with both Si 3 N 4 and ALD based deposition methods is that both materials are either deposited at or require annealing steps at elevated temperatures which lim...