Tungsten–copper composite production by activated sintering and infiltration

Hamidi, Ahmad; Arabi, H.; Rastegari, S.

doi:10.1016/j.ijrmhm.2011.03.009

Cited by 129 publications

(34 citation statements)

References 6 publications

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“…has been undertaken [8,[15][16][17][18][19][20][21][22]. Sintered parts, however, are susceptible to several kinds of inherent defects and restrictions.…”

Section: Introductionmentioning

confidence: 99%

“…Sintered parts, however, are susceptible to several kinds of inherent defects and restrictions. Examples are process intrinsic inhomogeneities and the inclusion of pores, limitations regarding obtainable compositions and restrictions on minimum microstructural length scales [8,[15][16][17][18][19][20][21][22]. Sputter deposition in contrast presents the opportunity to homogeneously distribute several elements simultaneously [9,23].…”

Section: Introductionmentioning

confidence: 99%

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From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

2015

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“…has been undertaken [8,[15][16][17][18][19][20][21][22]. Sintered parts, however, are susceptible to several kinds of inherent defects and restrictions.…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

2015

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“…However, it is dicult to fabricate alloy and composites with homogeneous microstructure, because W and Cu have no solubility of each other through the whole composition [7]. In WCu composites, Ni addition improves the wetting and adhesion of Cu and W and facilitates nonporous composite production [6,8]. …”

mentioning

confidence: 99%

Development of W-Cu-Ni Electrical Contact Materials with Enhanced Mechanical Properties by Spark Plasma Sintering Process

Lungu¹,

Tsakiris²,

Enescu³

et al. 2014

Acta Phys. Pol. A

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This study reports on the development of some WCuNi materials for use as electrical contacts for low voltage vacuum switching contactors for nominal currents up to 630 A. The contact materials with 85 wt% W, 1214 wt% Cu and 13 wt% Ni were obtained by spark plasma sintering process in vacuum. From very nely dispersed WCuNi powder mixtures there were produced sintered electrical contact pieces that were investigated in terms of physical, microstructural, mechanical, and functional properties. The material sintered at 1200• C exhibited a near fully dense structure with very low porosity and enhanced mechanical properties: hardness of maximum 480 HV1 and elastic modulus of maximum 220 GPa and low chopping current of maximum 1.77 A.

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“…Infiltration (infiltrate Cu into W skeleton) is the most common process used in the preparation of tungstencopper alloy [5,6]. But the alloy prepared by infiltration has extremely high W-W contiguity, and it is well known that W-W interface has the weakest combination in tungsten alloy interfaces due to lack of metallurgical bonding, in which microcracks can be easily generated and expand under applied load and finally cause the failure of the materials [7].…”

Section: Introductionmentioning

confidence: 99%

“…In W-Cu composites, the additions of Ni, Co, Fe and Pd were used in activated sintering, so as to improve the wettability and adhesion between copper and tungsten and facilitate the production of high-density tungsten-copper alloy under the condition of low temperature [5,12]. Azar et al [11] evaluated the effect of Ag additives on the densification of tungstencopper composites, and the results showed that the maximum relative density was 99.6 % with 10 wt%Ag sintered at 1200°C.…”

Section: Introductionmentioning

confidence: 99%

Preparation and properties of W–Cu–Zn alloy with low W–W contiguity

Zheng

Liu

et al. 2015

Rare Met.

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The W-Cu-Zn alloy with a-brass matrix and low W-W contiguity was prepared by method of electroless copper plating combined with spark plasma sintering (SPS) method. The effects of process and parameters on the microstructure and mechanical properties of the alloy were investigated. The W-Cu-Zn alloy with a relative density of 96 % and a W-W contiguity of about 10 % was prepared by original fine tungsten particles combined with wet mixing method and SPS solid-state sintering method at 800°C for 10 min. The microstructure analysis shows that Cu-Zn matrix consists of nano-sized a-brass grains, and the main composition is Cu 3 Zn electride. The nano-sized Cu was coated on the surface of tungsten particles by electroless copper plating method, and the fairly low consolidation temperature and short solid-state sintering time result in the nano-sized matrix phase. The dynamic compressive strength of the W-Cu-Zn alloy achieves to 1000 MPa, but the alloy shows poor ductility due to the formation of the hard and brittle Cu 3 Zn electrides. The fine-grain strengthening and the solution strengthening of the Cu-Zn matrix phase are responsible for the high Vickers microhardness of about 300 MPa for W-Cu-Zn alloy.

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Tungsten–copper composite production by activated sintering and infiltration

Cited by 129 publications

References 6 publications

From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

Development of W-Cu-Ni Electrical Contact Materials with Enhanced Mechanical Properties by Spark Plasma Sintering Process

Preparation and properties of W–Cu–Zn alloy with low W–W contiguity

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