2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2022
DOI: 10.1109/dtip56576.2022.9911719
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Tungsten grid enhanced thin-film wafer-level encapsulation for monolithically integrated D-Band RF-MEMS switches in a 130 nm BiCMOS technology

Alexander Göritz
1
,
Selin Tolunay Wipf
2
,
Martin Drost
3
et al.
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