Two-Branch Coupling Cauer Model in IGBT Module Considering FWD Thermal Coupling Effect

Yan, Qing; Li, Aoyang; Wang, Gengji; Yin, Jinliang; Dong, Chao; Du, Mingxing

doi:10.1109/tcpmt.2024.3382631

IEEE Trans. Compon., Packag. Manufact. Technol.

2024

DOI: 10.1109/tcpmt.2024.3382631

|View full text |Cite

Two-Branch Coupling Cauer Model in IGBT Module Considering FWD Thermal Coupling Effect

Qing Yan,

Aoyang Li,

Gengji Wang

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

A Thermal Impedance Model for IGBT Modules Considering the Nonlinear Thermal Characteristics of Chips and Ceramic Materials

Wang,

Liang,

Jin

et al. 2024

Electronics

View full text Add to dashboard Cite

The traditional method of calculating junction temperature does not consider the dependence of a material’s thermal conductivity on temperature, in which the thermal conductivity changes with temperature. However, with an increase in junction temperature, the temperature sensitivity (TS) will have a more significant impact on the actual temperature of chips. This study established an improved IGBT equivalent thermal impedance model that considers the nonlinear characteristics of the TS of chips and ceramic materials. The Fourier series analysis method was used to obtain the heat flux density curve, and then the heat diffusion angles of each layer were solved. Moreover, iterations were performed until the thermal conductivity and temperature of the chip and ceramic layers matched the nonlinear characteristics of the TS. When the power loss was less than 200 W, the maximum error of the junction temperature calculated by the proposed method considering TS was 3%, while the maximum error of the method without considering TS was 9.5%. Compared with the finite element simulation, the proposed method has a faster solving speed and high accuracy. The proposed method only requires the input material parameters, size parameters, and boundary conditions to solve the junction temperature, which has strong practicality and high accuracy.

show abstract

A Thermal Impedance Model for IGBT Modules Considering the Nonlinear Thermal Characteristics of Chips and Ceramic Materials

Wang,

Liang,

Jin

et al. 2024

Electronics

View full text Add to dashboard Cite

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Two-Branch Coupling Cauer Model in IGBT Module Considering FWD Thermal Coupling Effect

Cited by 1 publication

References 21 publications

A Thermal Impedance Model for IGBT Modules Considering the Nonlinear Thermal Characteristics of Chips and Ceramic Materials

A Thermal Impedance Model for IGBT Modules Considering the Nonlinear Thermal Characteristics of Chips and Ceramic Materials

Contact Info

Product

Resources

About