Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering

Abstract

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Depolarization of surface scattering in polarized laser scattering detection for machined silicon wafers

“…They suggested that the photoelasticity could be minimized by aligning the polarization direction to a principal stress direction. They further revealed that both the SSD depth and distribution density in a ground silicon wafer affects the polarized laser scattering detection, with SSD depth being the dominant factor [19]. PLS provides a potential for detecting SSD in monocrystalline silicon.…”

Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing

“…More related research must be conducted on Active Wafer Centering abroad, and the AWC algorithm requires only two sensors to obtain the relative distance between the wafer center and the manipulator. This paper focuses on the motion control and AWC wafer calibration algorithm for semiconductor equipment handling robots, aiming to achieve fast, stable, and efficient transmission and operation in the manufacturing environment [13][14][15][16][17][18][19]. The paper analyzes the transmission mechanism and kinematics of the semiconductor handling robot using the geometric method, and the results form the basis of the AWC algorithm.…”