2020
DOI: 10.1038/s41565-020-0724-3
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Two-dimensional materials for next-generation computing technologies

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Cited by 695 publications
(510 citation statements)
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“…22 2D layered semiconductors with atomic thickness possess the potential for continuous shrinking, [23][24][25] which is a promising candidate for future high-density memory and computing systems. 26,27 Particularly, 2D layered α-In2Se3 exhibits robust ferroelectricity at room temperature (RT) without annealing, 14,28,29 and thanks to the intrinsic interlocking of dipoles in α-In2Se3, 18,22 it can maintain ferroelectric polarization even at atomic scale.…”
Section: Abstract: 2d α-In2se3 Ferroelectric Channel Non-volatile Mmentioning
confidence: 99%
“…22 2D layered semiconductors with atomic thickness possess the potential for continuous shrinking, [23][24][25] which is a promising candidate for future high-density memory and computing systems. 26,27 Particularly, 2D layered α-In2Se3 exhibits robust ferroelectricity at room temperature (RT) without annealing, 14,28,29 and thanks to the intrinsic interlocking of dipoles in α-In2Se3, 18,22 it can maintain ferroelectric polarization even at atomic scale.…”
Section: Abstract: 2d α-In2se3 Ferroelectric Channel Non-volatile Mmentioning
confidence: 99%
“…Distinct from their bulk materials, 2D vdW materials exhibit many novel physical phenomena. Some 2D materials have already shown great potential for the engineering of next-generation 2D spintronic devices [10][11][12]. For example, graphene exhibits high electron/hole mobility, long spin lifetimes, and long diffusion lengths, which make it a promising candidate for a spin channel [13][14][15].…”
Section: Introductionmentioning
confidence: 99%
“…However, the conventional doping process such as ion implantation becomes increasingly difficult as the device dimensions decrease, and building CMOS logics with discrete p-and ndoped transistors complicates the device manufacturing process and limits the miniaturization of the circuits [1][2][3][4] . Meanwhile, with the booming demand of information processing capability, the traditional computing systems based on von Neumann architecture are encountering great challenges, due to the separation of computing and memory units [4][5][6][7] .…”
mentioning
confidence: 99%
“…However, the conventional doping process such as ion implantation becomes increasingly difficult as the device dimensions decrease, and building CMOS logics with discrete p-and ndoped transistors complicates the device manufacturing process and limits the miniaturization of the circuits [1][2][3][4] . Meanwhile, with the booming demand of information processing capability, the traditional computing systems based on von Neumann architecture are encountering great challenges, due to the separation of computing and memory units [4][5][6][7] . Reconfigurable devices with modifiable operating states or multiple functions are quite meaningful for the miniaturization of circuits, by reducing the number of devices, promoting the integration of circuits, and endowing the circuits with versatility 2, [8][9][10] .…”
mentioning
confidence: 99%
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