Two dimensional shear lag solution for stress transfer between rectangular piezoelectric wafer transducer and orthotropic host plate

Kapuria, S.; Agrahari, Jitendra Kumar

doi:10.1016/j.euromechsol.2015.09.003

Cited by 15 publications

(6 citation statements)

References 19 publications

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“…It is applied in the interface fracture mechanics considering cracking, decohesion and delamination of a thin film on a composite panel (substrate). Kapuria and Agrahari have proposed a two‐dimensional shear lag model for the stress transfer between a rectangular piezoelectric wafer transducer and an orthotropic host plate bonded through an adhesive layer. The authors have conducted parametric studies to illustrate the effects of thicknesses of the adhesive layer, the host plate and the transducer, the aspect ratio of the transducer and longitudinal to transverse modulus ratio of the host plate on the actuator stresses and interfacial shear stresses induced by the actuation potential.…”

Section: Introductionmentioning

confidence: 99%

Influence of the geometry and the frequency range on the interface delamination in smart patch/layer structures under combined dynamic loading

Kirilova

Petrova

Becker

et al. 2017

Z. Angew. Math. Mech.

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The paper deals with the interface behavior of a smart patch/layer lightweight structure subjected to combined time harmonic mechanical loading, electric field and environmental conditions. The applied dynamic shear-lag and Fourier method refer to the overlap zone of the considered structure. It gives a possibility to obtain solutions in a closed form for axial and shear stresses of the structure. The types of solutions obtained depend mainly on the adherends' thickness, the frequency interval of applied dynamic loading and the shear modulus of the used adhesive. At a given constant ratio of thicknesses of the adherends, the frequency interval of the dynamic load can change drastically the type of solution of the considered system of ordinary differential equations.Theoretical predictions for single debond length of patch/layer structure at an elastic-brittle interface behavior are provided. The influence of the ratio of thicknesses of the adherends in PZT-5H/CFRP patch/layer structure and the frequency range of applied dynamic mechanical loading on the interface delamination is investigated. All results are illustrated in figures and tables and are discussed.

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Section: Introductionmentioning

confidence: 99%

Influence of the geometry and the frequency range on the interface delamination in smart patch/layer structures under combined dynamic loading

Kirilova

Petrova

Becker

et al. 2017

Z. Angew. Math. Mech.

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“…The solution considers the shear-lag effect due to the bonding layer between the transducers and the isotropic host plate. The 2D shear-lag solution presented by Kapuria and Agrahari (2016) has shown that for an isotropic host plate with square-shaped transducers, the shear stress distribution matches well with the plane strain solution. Accordingly, both shear-lag solutions of the transducer–plate interactions and wave propagation solution are developed assuming the plane strain conditions for transducers and the plate.…”

Section: Introductionmentioning

confidence: 69%

“…Crawley and Luis (1987) presented the one-dimensional (1D) shear-lag solution for interfacial shear stress considering the transducer and plate under plane stress condition, and the same was adopted by Scalea and Salamone (2008). However, the results from the 2D shear-lag solution of Kapuria and Agrahari (2016) have revealed that for a square piezoelectric patch actuator bonded to an isotropic plate, the interfacial shear stress distribution matches well with the 1D shear-lag solution if both the transducer and the plate are considered under the plane strain condition. Accordingly, the latter condition is considered here.…”

Section: Shear Stress Due To Actuationmentioning

confidence: 82%

“…where b = h a =G a and u 1 and u 2 denote the inplane displacements of the plate and the transducer, respectively, at their interfaces with the bonding layer. Assuming linear distribution of the inplane displacement across the plate thickness under the Kirchhoff hypothesis and following the approach given by Kapuria and Agrahari (2016), the equilibrium of force and moment resultants yield the following relation for stresses in the plate at the bonding layer interface…”

Section: Shear Stress Due To Actuationmentioning

confidence: 99%

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Shear-lag solution for excitation, sensing, and time reversal of Lamb waves for structural health monitoring

Kapuria

Agrahari

2017

Journal of Intelligent Material Systems and Structures

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An analytical solution is presented for excitation, forward propagation, sensing, and time reversal of Lamb waves, considering the shear-lag effect of the bonding layer between the piezoelectric patch transducers and the plate. Consistent shear-lag solutions for actuator–plate and plate–sensor interactions are developed, considering plane strain condition. The Lamb wave solution is obtained by transforming the interfacial shear stress distribution and wave equations into the wavenumber domain by applying the spatial Fourier transform and converting the same to the physical domain using the inverse Fourier transform and residue theorem. The time-domain response for an arbitrary excitation is obtained by applying the temporal Fourier transform to the excitation and using convolution integral. The solution is compared with the experimental and numerical results for both forward and time-reversal responses and also for the best reconstruction frequency. The effect of transducer mass on the accuracy of the response is investigated. Finally, the shear-lag effect on the time reversibility of the reconstructed signal is studied for varying adhesive layer thickness, transducer thickness, host plate thickness, and the tone burst count. The solution will be useful for designing structural health monitoring systems using both baseline-based and baseline-free methods.

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“…Wang et al (2013b) concerned with the stress transferred in adhesive layer with crack based on Timoshenko beam theory. Kapuria and Agrahari (2016) developed a two-dimensional shear lag model for an orthotropic host plate with a single PZT bonded perfectly. The host plate was modeled based on the classical Kirchhoff plate theory and the stress transferred by adhesive layer was treated as pure shear stress state.…”

Section: Introductionmentioning

confidence: 99%

Modeling and simulation of bonded-type piezoelectric linear motors considering the stress transfer in adhesive layer

Yao

Dai

et al. 2021

Journal of Intelligent Material Systems and Structures

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This paper provides a general framework for modeling bonded-type piezoelectric linear motors considering the stress transferred by adhesive layer. A three-dimensional static model of stator is first developed by the principle of minimum potential energy and finite element. The stress transferred by adhesive layer could be simulated and analyzed for arbitrary bonding conditions. Basing on the static stress-transfer analysis, a quasi-static stress acted to substrate by piezoelectric elements is assumed and integrated into the substrate dynamic model. A pure mechanical dynamic model is developed for the electromechanical coupling system of stator. Furthermore, the whole-machine dynamic model of motor is presented by incorporating the frictional contact force into the dynamic model of the stator and an analytical model of the mover. Finally, a bonded-type piezoelectric linear motor with V-shaped stator is investigated as an example for simulations and experiments. The methodology presented here for simulating the transferred load of adhesive layer in bonded-type piezoelectric motor as well as for estimating the vibration characteristics of stator and output performances of motor. It is believed that the proposed method would be helpful to design and manufacture the prototypes due to the wider applicability of allowing for irregular geometry and any bonding conditions.

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Two dimensional shear lag solution for stress transfer between rectangular piezoelectric wafer transducer and orthotropic host plate

Cited by 15 publications

References 19 publications

Influence of the geometry and the frequency range on the interface delamination in smart patch/layer structures under combined dynamic loading

Influence of the geometry and the frequency range on the interface delamination in smart patch/layer structures under combined dynamic loading

Shear-lag solution for excitation, sensing, and time reversal of Lamb waves for structural health monitoring

Modeling and simulation of bonded-type piezoelectric linear motors considering the stress transfer in adhesive layer

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