2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2013
DOI: 10.1109/siitme.2013.6743669
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Two parameter extraction solutions for high temperature SiC Schottky diodes — Converging to reality

Abstract: This paper presents two methods of parameter extraction for SiC Schottky diodes. These methods are implemented and tested for characteristics of real devices (SiC Schottky diodes). Extra attention is paid to how these two methods can converge to the same solution and how the extracted results can offer valuable information about potential device technology improvement.

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