Ultra compact, low thermal impedance and high reliability module structure with SiC Schottky Barrier Diodes

Ikeda, Yoshinari; Nashida, Norihiro; Horio, Masafumi; Takubo, Hiromu; Takahashi, Yoshikazu

doi:10.1109/apec.2011.5744760

Cited by 6 publications

(1 citation statement)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This is because the working temperature in typical electronic components ranges from 50 to 300 °C [ 26 ]. Similarly, in automobiles, the operating temperature of logic devices is less than 200 °C [ 27 ]. Moreover, in military applications, some electronic devices need to maintain a working temperature of less than 125 °C for ideal operation [ 28 ].…”

Section: Finite Element Analysismentioning

confidence: 99%

Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

et al. 2017

View full text Add to dashboard Cite

Copper/diamond (Cu/D) composites are famous in thermal management applications for their high thermal conductivity values. They, however, offer some interface related problems like high thermal boundary resistance and excessive debonding. This paper investigates interfacial debonding in Cu/D composites subjected to steady-state and transient thermal cyclic loading. A micro-scale finite element (FE) model was developed from a SEM image of the Cu/20 vol % D composite sample. Several test cases were assumed with respect to the direction of heat flow and the boundary interactions between Cu/uncoated diamonds and Cu/Cr-coated diamonds. It was observed that the debonding behavior varied as a result of the differences in the coefficients of thermal expansions (CTEs) among Cu, diamond, and Cr. Moreover, the separation of interfaces had a direct influence upon the equivalent stress state of the Cu-matrix, since diamond particles only deformed elastically. It was revealed through a fully coupled thermo-mechanical FE analysis that repeated heating and cooling cycles resulted in an extremely high stress state within the Cu-matrix along the diamond interface. Since these stresses lead to interfacial debonding, their computation through numerical means may help in determining the service life of heat sinks for a given application beforehand.

show abstract

Section: Finite Element Analysismentioning

confidence: 99%