2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 2012
DOI: 10.1109/3dic.2012.6263008
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Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs application

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“…The third option involves the patterning of microcoils, a choice that implies an increased level of complication in terms of both design and fabrication and is being actively pursued by many research groups [118][119][120][121]. The magnetic field generation requires an electrical current flow, which has a dramatic impact on the power dissipation and thermal budget characteristics of the manufactured components.…”
Section: Excitation Sourcesmentioning
confidence: 99%
“…The third option involves the patterning of microcoils, a choice that implies an increased level of complication in terms of both design and fabrication and is being actively pursued by many research groups [118][119][120][121]. The magnetic field generation requires an electrical current flow, which has a dramatic impact on the power dissipation and thermal budget characteristics of the manufactured components.…”
Section: Excitation Sourcesmentioning
confidence: 99%