Ultra-high aspect ratio pores milled in diamond via laser, ion and electron beam mediated processes

Martin, Aiden A.; Bishop, James; Burnett, Wayne; Alfonso, N.; Kong, C.; Forsman, A.; Carlson, L.; Rice, N.; Stadermann, Michael; Toth, Milos; Bunn, Thomas L.

doi:10.1016/j.diamond.2020.107806

Cited by 8 publications

(3 citation statements)

References 39 publications

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“…Therefore, diamond laser processing has become the first choice for rapid microporous molding. Martin [59] used a double-pulsed laser to ablate the diamond material on the silica sphere substrate for the preparation of diamonds. The double-pulse laser ablation of diamond material on a silica sphere substrate to prepare diamond micropores is shown in Figure 9B, in which funnel-shaped cones are cut across the diamond layer above, with depth-to-width ratios measured at the surface and at a 50% depth of 8:1 and 14.5:1, respectively; however, due to the thinness of the processed diamond film (65 µm), it is not very generalizable for practical processing.…”

Section: Laser Drillingmentioning

confidence: 99%

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Research and Application Progress of Laser-Processing Technology in Diamond Micro-Fabrication

Zhang,

Xu,

Cui

et al. 2024

Micromachines

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Laser-processing technology has been widely used in the ultra-precision machining of diamond materials. It has the advantages of high precision and high efficiency, especially in the field of super-hard materials and high-precision parts manufacturing. This paper explains the fundamental principles of diamond laser processing, introduces the interaction mechanisms between various types of lasers and diamond materials, focuses on analyzing the current development status of various modes of laser processing of diamond, briefly discusses the relevant applications in diamond cutting, micro-hole forming, and micro-groove machining, etc., and finally discusses the issues, challenges, and potential future advancements of laser technology in the field of diamond processing at this point.

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Section: Laser Drillingmentioning

confidence: 99%

“…Figure 9. (A)The cutting effect diagram of different focus settings and the relationship between laser power and cutting depth and slit width[57]; (B) radiograph of micropores fabricated in a diamond on silicon sphere substrate by the double-pulse laser ablation method[59]; and (C) the average depth to width ratio obtained in diamond is 40∶1[60].…”

mentioning

confidence: 99%

Research and Application Progress of Laser-Processing Technology in Diamond Micro-Fabrication

Zhang,

Xu,

Cui

et al. 2024

Micromachines

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“…For this purpose, a precise conversion of graphite to diamond is not feasible at the moment, since a very strong (>100 GPa) and fast (<1 ps) compression wave applied normal to the basal plane of the graphite is needed to drive this fundamental phase transition [5], a task that is hardly technologically achievable at the moment. Phase conversion of diamond into graphite remains exceptionally challenging since there are only a few processes capable of delivering a well-apportioned energy for the phase conversion and these include ion beam milling and/or etching method [6], electron-beam milling [7] and laser processing [8]. The latter is currently the only process that has a potential to provide a satisfactory high spatial resolution, low surface roughness and, a high material removal rate to process diamond.…”

Section: Introductionmentioning

confidence: 99%

Optimised diamond to graphite conversion via a metastable sp1-bonded carbon chain formation under an ultra-short femtosecond (30 fs) laser irradiation

Ali

Sang

et al. 2023

Carbon

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High aspect ratio diamond nanosecond laser machining

et al. 2023

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Laser processing of diamond has become an important technique for fabricating next generation microelectronic and quantum devices. However, the realization of low taper, high aspect ratio structures in diamond remains a challenge. We demonstrate the effects of pulse energy, pulse number and irradiation profile on the achievable aspect ratio with 532 nm nanosecond laser machining. Strong and gentle ablation regimes were observed using percussion hole drilling of type Ib HPHT diamond. Under percussion hole drilling a maximum aspect ratio of 22:1 was achieved with 10,000 pulses. To reach aspect ratios on average 40:1 and up to 66:1, rotary assisted drilling was employed using > 2 M pulse accumulations. We additionally demonstrate methods of obtaining 0.1° taper angles via ramped pulse energy machining in 10:1 aspect ratio tubes. Finally, effects of laser induced damage are studied using confocal Raman spectroscopy with observation of up to 36% increase in tensile strain following strong laser irradiation. However, we report that upon application of 600 °C heat treatment, induced strain is reduced by up to ~ 50% with considerable homogenization of observed strain.

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Ultra-high aspect ratio pores milled in diamond via laser, ion and electron beam mediated processes

Cited by 8 publications

References 39 publications

Research and Application Progress of Laser-Processing Technology in Diamond Micro-Fabrication

Research and Application Progress of Laser-Processing Technology in Diamond Micro-Fabrication

Optimised diamond to graphite conversion via a metastable sp1-bonded carbon chain formation under an ultra-short femtosecond (30 fs) laser irradiation

High aspect ratio diamond nanosecond laser machining

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