2006 IEEE Aerospace Conference
DOI: 10.1109/aero.2006.1655979
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Ultra-Lightweight, High Efficiency SiC Based Power Electronic Converters for Extreme Environments

Abstract: Silicon-carbide (SiC) semiconductor devices are quickly becoming more prevalent and apparent. Clock have numerous potential advantages over their conventional speeds of microprocessors are increasing, approaching the silicon counterparts (i.e., higher switching frequencies, switching speed limitations of silicon-based devices; lower switching losses, higher temperature of operation, transistors are shrinking in size, resulting in higher power higher blocking voltages, higher thermal conductivity, densities and… Show more

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Cited by 23 publications
(7 citation statements)
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“…Currently, the copper layer on the ceramic substrate is usually nickel and/or gold plated in other to avoid oxidation of the copper layer. However, at very high temperatures (above 400°C) breakdown of this oxidation layer occurs -compromising reliability [187]. Extensive ongoing research into alternate finish materials like titanium, lead and molybdenum could offer realistic alternatives to gold and nickel finishes.…”
Section: Future Trendsmentioning
confidence: 99%
“…Currently, the copper layer on the ceramic substrate is usually nickel and/or gold plated in other to avoid oxidation of the copper layer. However, at very high temperatures (above 400°C) breakdown of this oxidation layer occurs -compromising reliability [187]. Extensive ongoing research into alternate finish materials like titanium, lead and molybdenum could offer realistic alternatives to gold and nickel finishes.…”
Section: Future Trendsmentioning
confidence: 99%
“…Because no other SiC physical intrinsic mechanism is supposed to limit Tj, the upper T jmax temperature limitation for SiC devices is more likely to be imposed by the high temperature performance and stability of all the die surrounding materials and their related interfaces and by the market need besides. Up to now, several high temperature SiC based circuits and devices have been reported, demonstrating short term operations up to 300 °C or 400 °C ambient temperatures (Mounce, 2006;Funaki, 2007). Connected to the thermal aspect, it should be added that high temperatures, and large thermal cycling magnitudes, mean more www.intechopen.com…”
Section: Specific Constraints Induced By Sic Propertiesmentioning
confidence: 99%
“…A literature research on lightweight power electronic converters reveals current publications to focus on three main topics: 1) Semiconductors: Highly efficient power converters, and converters operated at high temperatures [1], [12]- [16]. The high efficiency/temperature operation reduces the system weight predominately by reducing the cooling system requirements.…”
Section: Introductionmentioning
confidence: 99%