Ultra-low-modulus Photosensitive Polybenzoxazole Systems

Abstract

This work proposes ultra-low-modulus polybenzoxazoles (PBOs), which was derived from 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), a siloxanediamine (Si-DA), isophthaloyl chloride (IPC), and pyromellitic dianhydride (PMDA). The thermally cured PBO films achieved an ultra-low modulus (< 0.44 GPa). The PBO precursor (polyhydroxyamide, PHA) films possessed a relatively high i-line transmittance (T 365 > 44%), good tetramethylammonium hydroxide (TMAH) solubility. The PHA films dispersed diazonaphthoquinone (DNQ) allowed the formation of fine positive-tone patterns. Thus, the present ultra-low-modulus PBO systems can be promising candidates as novel buffer-coating materials in semiconductor applications.