2013
DOI: 10.1063/1.4813089
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Ultra-low reflectivity polycrystalline silicon surfaces formed by surface structure chemical transfer method

Abstract: A nanocrystalline Si layer can be formed by the surface structure chemical transfer (SSCT) method in which a platinum mesh is instantaneously contacted with polycrystalline Si wafers immersed in hydrogen peroxide plus hydrofluoric acid solutions. The polycrystalline Si surface after the SSCT method possesses an ultra-low reflectivity. The nanocrystalline Si layer possesses a 100–150 nm thickness, and gives a photoluminescence with a peak maximum at ∼670 nm, indicating band-gap widening. The minority carrier li… Show more

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Cited by 21 publications
(16 citation statements)
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“…PL maximum of a black silicon layer prepared on polycrystalline Si wafer at room temperature had the position ~1.85 eV [2]. A similar method was also applied for the preparation of the BSi samples in this contribution.…”
Section: David Publishingmentioning
confidence: 99%
“…PL maximum of a black silicon layer prepared on polycrystalline Si wafer at room temperature had the position ~1.85 eV [2]. A similar method was also applied for the preparation of the BSi samples in this contribution.…”
Section: David Publishingmentioning
confidence: 99%
“…We have recently developed a method to produce low reflectivity Si surfaces by the surface structure chemical transfer (SSCT) method [10,11] in which a catalytic Pt mesh was contacted with Si immersed in an H 2 O 2 plus HF solution. The reflectivity of the Si surface is reduced to less than 3% in the 300-800 nm wavelength region.…”
Section: Introductionmentioning
confidence: 99%
“…Due to an extremely fast surface reaction, a 6 in. wafer could be treated in ∼30 s. This SSCT method formed a nanocrystalline Si layer with $150 nm thickness [11]. After the SSCT method, nitric acid oxidation of Si (NAOS) method [12] was performed to form ultrathin SiO 2 on Si nanocrystals.…”
Section: Introductionmentioning
confidence: 99%
“…The PL maximum of a black silicon layer prepared on polycrystalline Si wafer at room temperature had the position ≈ 1.85 eV, [1]. A similar method was also applied for the preparation of the BSi samples in this contribution.…”
Section: Introductionmentioning
confidence: 99%