2005
DOI: 10.1016/j.jcrysgro.2005.09.005
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Ultra-low-temperature homoepitaxial growth of Sb-doped silicon

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Cited by 20 publications
(17 citation statements)
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“…To date, we have already demonstrated that this (previously demonstrated [9][10][11] ) Sb-doping process applied to TIS-provided silicon wafers is feasible and provides adequate activation and electrical conduction on 100 to 300 μm thick substrates. This work included optimizing the pre-MBE wafer-cleaning process and developing a new interlayer process to improve the quality of the Sb-doped layer.…”
Section: Discussionmentioning
confidence: 91%
See 1 more Smart Citation
“…To date, we have already demonstrated that this (previously demonstrated [9][10][11] ) Sb-doping process applied to TIS-provided silicon wafers is feasible and provides adequate activation and electrical conduction on 100 to 300 μm thick substrates. This work included optimizing the pre-MBE wafer-cleaning process and developing a new interlayer process to improve the quality of the Sb-doped layer.…”
Section: Discussionmentioning
confidence: 91%
“…The SIMS study on the sample (see Fig. 7) showed that surface segregation 9 is the cause of low dopant activation. To keep more of the dopant in the film, low growth temperatures (<450°C) are preferred.…”
Section: -14mentioning
confidence: 99%
“…The CCD temperature cannot exceed 500°C (preferably 450°C), due to interdiffusion of silicon and the aluminum metallization at these temperatures. For the n-type delta-doping technique, JPL has developed procedures that will ensure the temperature of the device never exceeds 450°C for the cleaning and epitaxial growth 23 .…”
Section: Current Resultsmentioning
confidence: 99%
“…Delta-doped CCDs, developed at JPL's Microdevices Laboratory, have achieved stable 100% internal quantum efficiency in the visible, near UV, and vacuum UV regions of the spectrum. [15][16][17][18][19][20][21] In this approach, an epitaxial silicon layer is grown on the back surface of a fully-fabricated CCD or CMOS back-illuminated imager using molecular beam epitaxy (MBE). 19 During the growth, approximately a third of a monolayer of dopant atoms is deposited on the surface, followed by growth of a silicon cap layer.…”
Section: A Delta Dopingmentioning
confidence: 99%