Ultra-thin actives for embedded components: halfway between thin film technology and embedded Surface Mounted Device

Balmont, Mickael; Bord‐Majek, Isabelle; Ousten, Yves

doi:10.1109/estc.2018.8546336

Cited by 5 publications

(2 citation statements)

References 10 publications

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“…The process is also very flexible; additionally to multiple dielectric and conductor layers, different types of connections, including blind or buried vias, can be implemented between the conductor layers [26]. The microchip can also be embedded inside the structure [82]. The dielectric layers can be of different materials, which helps to optimise the structure in terms of performance and price.…”

Section: Printed Circuit Board Technologymentioning

confidence: 99%

Exploitation of Transparent Conductive Oxides in the Implementation of a Window-Integrated Wireless Sensor Node

Jaakkola

Tappura

2018

IEEE Sensors J.

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Section: Printed Circuit Board Technologymentioning

confidence: 99%

Exploitation of Transparent Conductive Oxides in the Implementation of a Window-Integrated Wireless Sensor Node

Jaakkola

Tappura

2018

IEEE Sensors J.

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“…Bearing in mind the existing trend in the electronic industry to produce smaller and smaller devices, one of the examined approaches is embedding passive and active components into printed circuit boards (PCBs). So far many research works concerning thin- and thick-film passive components embedded in PCBs have been reported by Rahayu et al (2013), Akahoshi et al (2019), Balmont et al (2018) and Rovensky et al (2018). However, to produce more functional devices, such solutions are not sufficient.…”

Section: Introductionmentioning

confidence: 99%

Investigations of temperature sensor embedded into PCB

Janeczek

Araźna

Stęplewski

et al. 2020

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Purpose The purpose of this study is to design and fabricate a simple passive sensor circuitry embedded into a printed circuit board (PCB) and then to examine its properties. Design/methodology/approach A passive sensor transponder integrated circuit (IC) working in the high frequency (HF) 13.56 MHz frequency band was selected for this study. A loop antenna was designed to make the reported sensor circuitry readable. Next, the sensor circuitry was fabricated and embedded into a PCB with the proposed technologies. Finally, properties of the embedded structures were examined as well-functional parameters of the sensor circuitries. Findings The described investigation results confirmed that the proposed technologies using an epoxy resin or standard materials used for PCB’s production allowed to successfully produce sensors embedded into PCBs. This technology did not have a negative significant impact either on quality of solder joints of the assembled transponder IC or on functional properties of the embedded sensor. Apart from the identification data, the reported sensor can provide information about a selected property of its environment, e.g. temperature when its internal temperature sensitive element is used or other factors with the use of external sensitive elements, such as humidity. Research limitations/implications It is planned to carry on the reported investigations to examine other types of sensor circuitries capable of indicating e.g. humidity level and to evaluate influence of the proposed technology on their functional properties. Practical implications The reported sensor circuitries can be successfully used in electronic industry in internet of things systems not only to identify monitored electronic devices, but also to control selected parameters of external environment. This creates opportunity to detect device malfunction by detecting local temperature growth or to analyze its environment, which might allow to predict failure of controlled products using radio waves. This advantage seems to be extremely beneficial for applications, such as space, aviation or military, in which embedded sensor systems may lead to enhancing reliability of electronic devices by reacting on occurred failures in a more efficient way. Originality/value This study demonstrates valuable information for engineers conducting research on sensor components embedded into PCBs. The reported technologies are quite simple and cost-effective because of the use of standard materials known for PCB’s production or an epoxy resin which could be treated as an additional encapsulant material enhancing mechanical properties of the embedded sensor transponder IC.

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Realizing ultra-thin high reliability storage devices with large capacity by package and PCB collaborative design

Shi,

Yang,

Zhang

2023

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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Ultra-thin actives for embedded components: halfway between thin film technology and embedded Surface Mounted Device

Cited by 5 publications

References 10 publications

Exploitation of Transparent Conductive Oxides in the Implementation of a Window-Integrated Wireless Sensor Node

Exploitation of Transparent Conductive Oxides in the Implementation of a Window-Integrated Wireless Sensor Node

Investigations of temperature sensor embedded into PCB

Realizing ultra-thin high reliability storage devices with large capacity by package and PCB collaborative design

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