Sixth Symposium on Novel Optoelectronic Detection Technology and Applications 2020
DOI: 10.1117/12.2565318
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Ultra-thin benzocyclobutene bonding of InGaAs PIN photodetector onto silicon photonic chip

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“…Laser and silicon optical chip coupled by lenses Balanced photodetector composed of two PIN photodetectors, which are bonded on silicon chip and receive two beams of light signal form on-chip mixer. Ultra-thin layer benzocyclobutene (BCB) was coated on silicon chip, and photodetectors are bonded on the surface of silicon by BCB bonding technology13 . Light emitted vertically from the optical gratings to back-illuminated photodetector, as shown in Figure3.…”
mentioning
confidence: 99%
“…Laser and silicon optical chip coupled by lenses Balanced photodetector composed of two PIN photodetectors, which are bonded on silicon chip and receive two beams of light signal form on-chip mixer. Ultra-thin layer benzocyclobutene (BCB) was coated on silicon chip, and photodetectors are bonded on the surface of silicon by BCB bonding technology13 . Light emitted vertically from the optical gratings to back-illuminated photodetector, as shown in Figure3.…”
mentioning
confidence: 99%