Ultra‐Thin Flexible Encapsulating Materials for Soft Bio‐Integrated Electronics

Abstract

Recently, bioelectronic devices extensively researched and developed through the convergence of flexible biocompatible materials and electronics design that enables more precise diagnostics and therapeutics in human health care and opens up the potential to expand into various fields, such as clinical medicine and biomedical research. To establish an accurate and stable bidirectional bio-interface, protection against the external environment and high mechanical deformation is essential for wearable bioelectronic devices. In the case of implantable bioelectronics, special encapsulation materials and optimized mechanical designs and configurations that provide electronic stability and functionality are required for accommodating various organ properties, lifespans, and functions in the biofluid environment. Here, this study introduces recent developments of ultra-thin encapsulations with novel materials that can preserve or even improve the electrical performance of wearable and implantable bio-integrated electronics by supporting safety and stability for protection from destruction and contamination as well as optimizing the use of bioelectronic systems in physiological environments. In addition, a summary of the materials, methods, and characteristics of the most widely used encapsulation technologies is introduced, thereby providing a strategic selection of appropriate choices of recently developed flexible bioelectronics.

Intrinsically Nonswellable Multifunctional Hydrogel with Dynamic Nanoconfinement Networks for Robust Tissue‐Adaptable Bioelectronics

“…Recent remarkable advances in bioelectronic devices have facilitated the growth of the healthcare industry. [ 1 ] Accordingly, demands for practical bioelectronics enabling daily healthcare monitoring have surged. These so‐called smart healthcare devices require long‐term functionality within the human body.…”

Reliability of printed stretchable electronics based on nano/micro materials for practical applications

“…The commonly utilized elastomeric binders face challenges in serving as hermetic seals, though most of the reported works have applied them as encapsulations. 178 An ideal encapsulation can simultaneously maintain stretchability and protect the inner materials from the attack of ions and oxygen, thus enabling the wide selection of stretchable conductive materials in harsh working environments, for example, human biofluids. Unfortunately, the stretchability and permeability of small molecules are highly linked.…”

3D Printing of Liquid Metals: Recent Advancements and Challenges

“…[83] Therefore, the reliability of encapsulation is indispensable for practical applications of FEs-based products. [40] In this case, coaxial 3D printing and packaging can be performed simultaneously. [84] However, the DIW printed LMs features are commonly placed in the refrigerator for freezing and curing, and then packaged with PDMS.…”

“…[37][38][39] 4) The fluidity of LMs easily instigate leakage due to insufficient encapsulation. [40] In principle, flexible conductive lines play the key role to interconnect electronic components in FE devices, and flexible substrate/packaging materials are the prerequisite for the final realization of the functions of FEs. Therefore, to stimulate the huge potential of 3D printing of LMs, discussion on the material modification and printing technologies of LMs is extremely necessary.…”