Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength

Abstract

increase the distance between separated dies and step cuts to minimize the effect of decreasing fluence during scribing were performed. Bending tests revealed that breaking strengths of about 1100 MPa could be achieved also on the backside using the step cut. A reason for the superior performance could be found by calculating the fluence absorbed by the sidewalls. The calculations suggested that an optimal fluence level to minimize thermal side effects and periodic surface structures was achieved due to the step cut. Remarkably, the best breaking strengths values achieved in this study were even higher than the values obtained on state of the art ns-laser and mechanical dicing machines. This is the first study to the knowledge of the authors, which demonstrates that ultrafast-laser dicing improves the mechanical stability of thin silicon chips.

Desain Dan Implementasi Pemotong Ring Wafer Otomatis Berbasis Mikrokontroler Atmega328

“…Akan tetapi, masih ada perusahaan-perusahaan yang menggunakan mesin dan peralatan yang dioperasikan secara manual untuk memisahkan wafer dari ring wafer seperti dikawasan industri manufaktur mikroelektronika (Niklaus et al, 2009). Berbagai rancangan untuk memperbaiki wafer hasil pemotongan terus berkembang sehingga menghasilkan wafer yang presisi dan menjaga kestabilan mekanik (Domke et al, 2017), (Bleiker et al, 2017).…”

Good-Quality and High-Efficiency Dicing for Thick LiNbO3 Wafers Using Picosecond Laser Pulses

“…However, laser dicing is a potential for its high throughput and good-quality edges, which is capable of suppressing the mentioned problem. Laser dicing has attracted lots of attention on processing different semiconductor materials, such as silicon [14] and glass [15][16][17][18][19]. Nevertheless, there is minimal literature investigating the effect of picosecond-laser parameters on multiple characteristics in LiNbO 3 dicing using Taguchi method, which has been widely used in engineering to optimize the processing parameters and improve the yield and the reliability in machining a product by the means of orthogonal-array experiment design, analysis of variance (ANOVA) and signal to noise (S/N) ratio, etc.…”

Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends

“…The advantages can then be further exploited by combining it with, for example, blade dicing improving singulated die quality and reducing cost. In recent years, also ultra-short pulse (USP) laser processing has been available for production [7], [8]. The use of these lasers shows advantages of using ultra-short pulses compared to nanosecond pulses, which result in a different material removal mechanism and small to no heat affected zone (HAZ) in the material, low to no burr and a smooth groove bottom.…”