“…Furthermore, in the polymer foams the voids form due to the different nucleation time of constitutional solid and other external factor like temperature pressure [ 29 ]. Advanced EMI shielding materials should be lightweight, flexible, cost effective, dielectric, and multifunctional, and should possess a tunable absorption, high thermal resistance, intrinsic conductivity, large aspect ratio, high corrosion resistance, and good magnetic and electronic properties [ 19 , 20 , 30 , 31 , 32 , 33 , 34 ].…”