Grain boundaries activities are important for the deformation of nanocrystalline metals.Studies revealed that deformation mechanisms of nanocrystalline metals switch from dislocation-mediated regime to grain-boundary-mediated regime as approaching the "strongest" grain size. Basically, stress-driven grain growth, grain rotation and grain boundary sliding have been widely studied and discussed in the aspect of grain-boundary-mediated deformation mechanisms in nanocrystalline metals. Based on the previous studies, these grain-boundarymediated deformation mechanisms could perform in either individual forms or cooperative forms. However, limited studies have been focused on the cooperative form mechanisms for the grain-boundary-mediated deformation mechanism, especially for the cooperative grain boundary sliding mechanisms which could lead to more ductile performance than the pure grain boundary sliding. Particularly, only a few molecular dynamic simulation studies and theoretical prediction studies investigated the cooperative grain boundary sliding mechanism in nanocrystalline metals. Therefore, it is necessary to practically examine the true deformation behaviours in straining nanocrystalline metals.In this MPhil project, with utilising the homemade tensile device equipped with a transmission electron microscopy heating holder, in-situ transmission electron microscopy tensile tests are conducted for the magnetic-sputtering-fabricated nanocrystalline Au thin films (thickness ~ 15nm, average grain size ~ 16nm). In the in-situ experiments, the dynamic crack propagation processes of strained nanocrystalline Au films are clearly recorded under nanoscale bright-field TEM mode. It has been found that grain boundary sliding and stress-driven grain boundary migration are prevalent during the deformation processes. As cooperative deformation mechanism, stress-driven grain boundary migration assisted grain boundary sliding is confirmed experimentally. It is also found that cooperative grain boundary sliding mechanism