Ultrahigh-Speed Pulsed Laser Deposition of YBCO Layer in Processing of Long HTS Coated Conductors

Rutt, A.; Schneider, T.; Kirchhoff, L..; Hofacker, F.; Heßler, Andreas; Svistunova, O.; Kruglov, V. S.; Dietrich, R.; Usoskin, A.

doi:10.1109/tasc.2016.2536799

“…The architecture of the HTS tape is shown in Figure 1. HTS tapes with the same architecture have already demonstrated promising current performance in the high magnetic field [4] so this kind of tapes should be suitable for the magnet manufacturing. Two main deposition methods are used for the buffer and the superconductor layers fabrication.…”

Section: Hts Tapes Fabricationmentioning

confidence: 99%

Solenoid from Experimental HTS tape for Magnetic Refrigeration

Krasnoperov¹,

Guryev²,

Shavkin³

et al. 2019

JESTR

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“…III. PLD [3] deposition on the substrate tape with the YSZ buffer layer of additional CeO 2 matching buffer layer less than 0.2 µm thick and the main layer of superconducting ceramic YBa 2 Cu 3 O 7−δ (YBCO) about 2 µm thick.…”

Section: Introductionmentioning

confidence: 99%

Residual stress in the carrier tape AISI 310S at the stage of deposition of the YSZ buffer layer when manufacturing of HTS-2G wire

A.V.

¹

,

I.D.

²

,

V.S.

³

et al. 2022

Technical Physics

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Using neutron diffraction we determined internal residual stress in the stainless steel AISI 310S carrier tape with a thickness of 100 μm and a width of 4 mm after mechanical polishing and the ABAD deposition of the textured YSZ buffer layer. It is shown that mechanical polishing causes a slight distension of the tape in the rolling plane. After the deposition of the YSZ layer, uniform tensile stress of 70 MPa isotropic in the rolling plane was observed inside the tape. Calculations have shown that it results from relaxation of compressive stress acting on the surface of the tape in a layer several times thicker than the YSZ layer. It is assumed that the surface of the tape is plastically deformed during the YSZ deposition. Keywords: residual stress, YSZ buffer layer, HTS-2G wire, AISI 310S carrier tape, neutron stress diffractometry.

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“…III. Осаждение методом PLD [3] на ленту-подложку с буферным слоем YSZ дополнительного согласующего буферного слоя CeO 2 толщиной менее 0. IV.…”

Section: Introductionunclassified

Остаточные Напряжения В Несущей Ленте AISI 310S На Этапе Нанесения Буферного Слоя YSZ При Изготовлении Втсп-2 Провода

Irodova¹,

Karpov²,

Kruglov³

et al. 2021

Журнал Технической Физики

0

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Using neutron diffraction we determined internal residual stress in the stainless steel AISI 310S carrier tape with a thickness of 100 μm and a width of 4 mm after mechanical polishing and the ABAD deposition of the textured YSZ buffer layer. It is shown that mechanical polishing causes a slight distension of the tape in the rolling plane. After the deposition of the YSZ layer, uniform tensile stress of 70 MPa isotropic in the rolling plane was observed inside the tape. Calculations have shown that it results from relaxation of compressive stress acting on the surface of the tape in a layer several times thicker than the YSZ layer. It is assumed that the surface of the tape is plastically deformed during the YSZ deposition.

show abstract

Ultrahigh-Speed Pulsed Laser Deposition of YBCO Layer in Processing of Long HTS Coated Conductors

Cited by 7 publications

References 6 publications

Solenoid from Experimental HTS tape for Magnetic Refrigeration

Solenoid from Experimental HTS tape for Magnetic Refrigeration

Residual stress in the carrier tape AISI 310S at the stage of deposition of the YSZ buffer layer when manufacturing of HTS-2G wire

Остаточные Напряжения В Несущей Ленте AISI 310S На Этапе Нанесения Буферного Слоя YSZ При Изготовлении Втсп-2 Провода

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