2023
DOI: 10.1039/d3ta01676e
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Ultrahigh thermal conductive polymer composites by the 3D printing induced vertical alignment of carbon fiber

Abstract: As the power density increasing in electronic devices, requirements for high-performance thermal interface materials that can efficiently bridge the heat transport channel between the heat sink and the target electronics...

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Cited by 36 publications
(10 citation statements)
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“…Three models were set to the same boundary conditions: the top line was set to a constant temperature of 300 K, both sides (left and right sides) had perfectly thermal insulation, and the bottom was set to a heat flux of 1 × 10 7 W/m 2 . The steady-state heat transfer was calculated from the below equations normal∇ q⃗ = normalQ q⃗ = prefix− k normal∇ T where q⃗ is the heat flux vector, Q is the heat generation ( Q = 0 in this study because of the absence of heat generation inside the material matrix), T is the temperature, and k is thermal conductivity. , The thermal conductivities of PVDF and BNNT were set as 0.1 and 300 W/mK in the modeling studies, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…Three models were set to the same boundary conditions: the top line was set to a constant temperature of 300 K, both sides (left and right sides) had perfectly thermal insulation, and the bottom was set to a heat flux of 1 × 10 7 W/m 2 . The steady-state heat transfer was calculated from the below equations normal∇ q⃗ = normalQ q⃗ = prefix− k normal∇ T where q⃗ is the heat flux vector, Q is the heat generation ( Q = 0 in this study because of the absence of heat generation inside the material matrix), T is the temperature, and k is thermal conductivity. , The thermal conductivities of PVDF and BNNT were set as 0.1 and 300 W/mK in the modeling studies, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…Aligning nanoscale reinforcements in a polymer matrix results in a high enhancement efficiency of TC, and typical strategies include the ice-templated method, CVD, and 3D printing. The current studies on TIMs focus on the high TC enhancement of these nanocomposites, while the effect of material properties on the heat dissipation efficiency of devices has received limited attention. The effect of the contact thermal resistance between these nanocomposites and devices should be fully considered in future research, as it is a key parameter affecting the heat dissipation capability of advanced devices. Therefore, developing advanced TIMs to minimize the thermal resistance between the heat sink and device is a key topic in the field of thermal management.…”
Section: Applications Of Thermally Conductive Polymer Nanocompositesmentioning
confidence: 99%
“…The vertical alignment not only improved the thermal conductivity but also positively affected the mechanical strength and processing properties of the material. Zhang et al 38 successfully fabricated thermal interface materials with a remarkable planar thermal conductivity of 35.22 (W/mÁK) using 3D printing techniques, which induced a vertical orientation of carbon fibers. Lu et al 39 utilized the hydrothermal method to construct a microscopically bionic leaf vein-like three-dimensional structure of BN.…”
Section: Introductionmentioning
confidence: 99%