Ultralow Contact Resistivity on Ga-Doped Ge with Contact Co-Implantation of Ge and B

Abstract

A comparative study of Ga, Ge+B, and Ga+B ion-implantation (I/I) is reported to improve the specific contact resistivity (ρc) on p-type Ge. It is found that Ga I/I shows superiority for shallow source/drain (S/D) junctions doping over Ge+B I/I and Ga+B I/I in terms of activation (Na), junction depth (Xj) and ρc; whereas for contact surface doping, Ge+B I/I and Ga+B I/I demonstrate advantage over Ga I/I owing to less dose loss in NiGe and more robust B segregation at the NiGe/Ge interface. Using a combination of Ga I/I and Ge+B I/I for shallow S/D junctions and contact surface doping respectively, an ultralow ρc of 2.67×10-9 Ω-cm2 is achieved on p-type Ge.